Polymer Property : Glass Transition Temp, Tg = 30.0 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DSC; ASTM E1356-03
NeXolve White Optionox® Polyimide Film Highly UV durable with excellent weatherability and stability to ozone.Optinox® films and coatings are highly UV durable and exhibit excellent weathering durability, including very high stability ..
Glass Transition Temp, Tg	30.0 Â°C	86.0 Â°F
Mallard Creek Polymers RoveneÂ® 6117 Acrylic Emulsion Applications: RoveneÂ® 6117 is a clear drying, 100% acrylic, water resistant latex emulsion designed to provide protection for all types of concrete, cementitious and rigid surfaces. RoveneÂ® 61..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Lubrizol Estane® UB601 Thermoplastic Polyurethane Type: Estane® UB601 resin is a linear, hydroxyl terminated polyurethane polymer designed to be used as a binder for ink formulations. For ink applications, it gives high hardness to coated surface..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Master Bond EP36AN One Part, Toughened, B-Stage Epoxy Description: Master Bond EP36AN is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring thermal conductivity, electrical insulation and high tempe..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Trelleborg Emerson & Cuming Stycast® 2850FT-FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Glass Transition Temp, Tg	30.0 °C	86.0 °F
Loctite® Durabond® E-40FL Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Glass Transition Temp, Tg	<= 30.0 °C	<= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Post-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	DAM; 10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Zytel® RS LC2800 NC010 Nylon (Unverified Data**) Plasticized Renewably Sourced Polyamide Developed for Extrusion Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg	30.0 °C	86.0 °F	Ultimate Tg
Tra-Con Tra-Bond FS411 Fast Cure Epoxy Adhesive System TRA-BOND FS-411 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. It was designed to have low outgassing in ..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Glass Transition Temp, Tg	30.0 °C	86.0 °F	TM R050-25
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..