Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 135 °C | 275 °F | DSC |
Solvay Specialty Polymers Amodel® AE-8133 Polyphthalamide (PPA)
(discontinued **) Amodel AE-8133 is a 33% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. This grade features a high heat deflection temperature, high flexural.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with .. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | TMA |
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | MCI Method |
Mitsui APELâ„¢ APL5014DP Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | dry |
Henkel Hysol EA 9681 Film Adhesive Epoxy film adhesive for bonding applications. Hysol EA9681 is formulated to provide excellent performance properties for many bonding applications, and has excellent results on composite surfaces th.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | DSC; ASTM D3418 |
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | DSC |
Solvay Specialty Polymers Amodel® AE-8930 Polyphthalamide (PPA), 30% Glass Fiber Amodel® AE-8930 is a 30% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. Features: Glycol Resistant; Good Chemical Resistance; Good Creep .. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | DSC |
Solvay Specialty Polymers Amodel® AE-8950 Polyphthalamide (PPA), 50% Glass Fiber Amodel® AE-8950 is a 50% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. Features: Glycol Resistant; Good Chemical Resistance; Good Creep .. |
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Glass Transition Temp, Tg | >= 135 °C | >= 275 °F | |
Zeon Chemicals Zeonex® E48R Cyclo-Olefin Polymer |
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Glass Transition Temp, Tg | 135 °C | 275 °F | Ultimate Tg |
Tra-Con Tra-Bond 221N01 Information provided by Tra-Con Inc. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | |
Loctite® 3566 Rapid Flow Low Profile Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | Ultimate Tg |
Tra-Con Tra-Bond 226U01 High Temperature Controlled Flow Adhesive TRA-BOND 226U01 is a one-part, controlled flow adhesive with high temperature resistance.Information provided by Tra-Con Inc. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | ISO 11357 |
Arkema Group Rilsan® Clear G380 Renew Polyamide Rilsan® Clear G830 Rnew is a high performance transparent polyamide partially based on renewable resources. This grade has been specially designed for injection molding applications, ideally suited.. |
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Glass Transition Temp, Tg | 135 °C | 275 °F | DSC; IPC TM-650 2.4.25 |
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal .. |
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Glass Transition Temp, Tg | >= 135 °C | >= 275 °F | Cured property; Perkin Elmer TMS-2 |
Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Pa.. |