Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Glass Transition Temp, Tg = 275 °F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Thermal Properties Metric English Comments
Glass Transition Temp, Tg 135 °C
275 °F
DSC
Solvay Specialty Polymers Amodel® AE-8133 Polyphthalamide (PPA)  (discontinued **)
Amodel AE-8133 is a 33% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. This grade features a high heat deflection temperature, high flexural..
Glass Transition Temp, Tg 135 °C
275 °F
TMA
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with ..
Glass Transition Temp, Tg 135 °C
275 °F
TMA
Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is..
Glass Transition Temp, Tg 135 °C
275 °F
TMA
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant
LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch..
Glass Transition Temp, Tg 135 °C
275 °F
MCI Method
Mitsui APELâ„¢ APL5014DP Cyclo Olefin Copolymer (COC)
This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces..
Glass Transition Temp, Tg 135 °C
275 °F
dry
Henkel Hysol EA 9681 Film Adhesive
Epoxy film adhesive for bonding applications. Hysol EA9681 is formulated to provide excellent performance properties for many bonding applications, and has excellent results on composite surfaces th..
Glass Transition Temp, Tg 135 °C
275 °F
DSC; ASTM D3418
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant
CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a ..
Glass Transition Temp, Tg 135 °C
275 °F
DSC
Solvay Specialty Polymers Amodel® AE-8930 Polyphthalamide (PPA), 30% Glass Fiber
Amodel® AE-8930 is a 30% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. Features: Glycol Resistant; Good Chemical Resistance; Good Creep ..
Glass Transition Temp, Tg 135 °C
275 °F
DSC
Solvay Specialty Polymers Amodel® AE-8950 Polyphthalamide (PPA), 50% Glass Fiber
Amodel® AE-8950 is a 50% glass reinforced polyphthalamide (PPA) designed to work in the modern automotive electrical environment. Features: Glycol Resistant; Good Chemical Resistance; Good Creep ..
Glass Transition Temp, Tg >= 135 °C
>= 275 °F
Zeon Chemicals Zeonex® E48R Cyclo-Olefin Polymer
Glass Transition Temp, Tg 135 °C
275 °F
Ultimate Tg
Tra-Con Tra-Bond 221N01
Information provided by Tra-Con Inc.
Glass Transition Temp, Tg 135 °C
275 °F
Loctite® 3566 Rapid Flow Low Profile Underfill
COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Glass Transition Temp, Tg 135 °C
275 °F
Ultimate Tg
Tra-Con Tra-Bond 226U01 High Temperature Controlled Flow Adhesive
TRA-BOND 226U01 is a one-part, controlled flow adhesive with high temperature resistance.Information provided by Tra-Con Inc.
Glass Transition Temp, Tg 135 °C
275 °F
ISO 11357
Arkema Group Rilsan® Clear G380 Renew Polyamide
Rilsan® Clear G830 Rnew is a high performance transparent polyamide partially based on renewable resources. This grade has been specially designed for injection molding applications, ideally suited..
Glass Transition Temp, Tg 135 °C
275 °F
DSC; IPC TM-650 2.4.25
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply
Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal ..
Glass Transition Temp, Tg >= 135 °C
>= 275 °F
Cured property; Perkin Elmer TMS-2
Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound
Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Pa..
Copyright © lookpolymers.com All Rights Reserved