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Polymer Property : Glass Transition Temp, Tg = 210 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREBOARD E1025 Standard Epoxy Circuit Boards
Standard epoxy (FR4) circuit boards do not lend themselves for high frequency applications due to the poor dielectric properties. For that reason PTFE is used predominately. This is an expensive mat..
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREBOARD E1026 Standard Epoxy Circuit Boards
PREBOARD is a thermoplastic based PCB laminate. Low dissipation factor leads to high gain in the antennas. As a non filled laminate PREBOARD is fully homogenous so that consistant properties are ac..
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREFLEX E100 Polyphenylene Ether (PPO/PPE)
PREFLEX films combine outstanding dielectric properties, good heat stability, low water absorption and chemical resistance in a way not available before. Also rigid boards made of the same material ..
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREFLEX E12.5 Polyphenylene Ether (PPO/PPE)
PREFLEX films combine outstanding dielectric properties, good heat stability, low water absorption and chemical resistance in a way not available before. Also rigid boards made of the same material ..
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREFLEX E25 Polyphenylene Ether (PPO/PPE)
PREFLEX films combine outstanding dielectric properties, good heat stability, low water absorption and chemical resistance in a way not available before. Also rigid boards made of the same material ..
Glass Transition Temp, Tg 210 °C
410 °F
Premix Thermoplastics PREFLEX E50 Polyphenylene Ether (PPO/PPE)
PREFLEX films combine outstanding dielectric properties, good heat stability, low water absorption and chemical resistance in a way not available before. Also rigid boards made of the same material ..
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Duratron® PEI U1000 LSG Polyetherimide, unfilled, extruded, Biocompatibility tested (ASTM Product Data Sheet)
Duratron® U1000 (Formerly Ultem® 1000) polyetherimide is an amorphous, high-performance polymer with exceptional flame and heat resistance. It performs continuously to 340°F (171°C), making it..
Glass Transition Temp, Tg 210 °C
410 °F
ISO 6721 DMS
Premix Premi-Glas® 1286 Glass Reinforced SMC
Description: Premi-Glas® 1286 is a glass reinforced thermoset sheet molding compound designed for automotive under the hood applications. Key features and benefits: Designed for compression molding..
Glass Transition Temp, Tg 210 °C
410 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Park Electrochemical Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg
The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-13 BC® Buried Capacitance™, High-Speed Multifunctional Epoxy Laminate and Prepreg
The Nelco N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. The Nelco N4000-13 BC® is offered as a..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-13 EP™ BC® Buried Capacitance™, High-Speed Multifunctional Epoxy Laminate and Prepreg
Nelco N4000-13 EP™ is an enhanced epoxy resin system engineered for today’s leadfree requirements where multiple solder reflow at temperatures approaching 260ºC are required. N4000-13 EP provides..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-13 High-Speed Multifunctional Epoxy Laminate and Prepreg
The Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applic..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-13 SI® High-Speed Multifunctional Epoxy Laminate and Prepreg
The Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applic..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4350-13 RF Microwave Performance, Modified Epoxy
The Nelco N4350-13 RF and N4380-13 RF series are enhanced epoxy resin systems specifically engineered to provide a unique solution for design applications that demand outstanding thermal properties,..
Glass Transition Temp, Tg 210 °C
410 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4380-13 RF Microwave Performance, Modified Epoxy
The Nelco N4350-13 RF and N4380-13 RF series are enhanced epoxy resin systems specifically engineered to provide a unique solution for design applications that demand outstanding thermal properties,..
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Duratron® PEI U1000 Extruded Unfilled Polyetherimide (ASTM Product Data Sheet)
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Duratron® PEI U2300 Extruded 30% Glass Reinforced Polyetherimide (ASTM Product Data Sheet)
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Semitron® ESd 410C- CM Dissipative Polyetherimide(ASTM Product Data Sheet)
Glass Transition Temp, Tg 210 °C
410 °F
Hybrid Plastics PO6C81.01 Nanoreinforced® Polyphenylene Oxide (PPO)
PPO available on the market today is typically mixed with polystyrene or other polymers to make it processable. However, these resins degrade the excellent mechanical and flammability properties of ..
Glass Transition Temp, Tg 210 °C
410 °F
wet
Henkel Hysol EA 9673 (BMI) Film Adhesive
Modified BMI film adhesive, superior strength to 550°F / 288°C. Moisture resistant, processes like conventional high temperature epoxies. Minimum order required. Data from 0.10 psf, 500 g / m2..
Glass Transition Temp, Tg 210 °C
410 °F
DSC
Wolf Kunststoff ZEDEX® ZX-410 A4A Polymer Alloy
ZX-410 is a bearing material with excellent properties and a very affordable price.Main Characteristics: Hard, Stiff, Tough; High dimensional stability; High chemical resistance; High water resistan..
Glass Transition Temp, Tg 210 °C
410 °F
TMA; IPC TM-650 2.4.24
Arlon 37N Polyimide Low-Flow
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is requir..
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Duratron® U2100 OEI Extruded 10% Glass Reinforced Polyetherimide
Glass Transition Temp, Tg 210 °C
410 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg
The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Duratron® U2200 PEI Extruded 20% Glass Reinforced Polyetherimide
Glass Transition Temp, Tg 210 °C
410 °F
ASTM D3418
Quadrant EPP Semitron® ESd 420- CM Dissipative Polyetherimide(ASTM Product Data Sheet)
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