Polymer Property : Glass Transition Temp, Tg = 192 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	89.0 °C	192 °F	Polystyrene; ASTM D3418
Proto3000 CastForm™ PS Selective Laser Sintering (SLS®) Prototyping Polymer Description: Directly produce complex investment casting patterns without tooling..Features: Functions like foundry wax and is “foundry friendly”Low residual ash content (less than 0.02%)Short bur..
Glass Transition Temp, Tg	89.0 - 104 °C	192 - 219 °F	Average value: 98.0 °C Grade Count:7
Overview of materials for Polystyrene, Heat Resistant Grade This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Heat Resistant Grade". Each property range of values reported is minimum and maximum values..
Glass Transition Temp, Tg	89.0 °C	192 °F	10°C/min test
Polimeri Europa EDISTIR N1460 Polystyrene (discontinued **) Symbol according to ISO 1043-1: PS Designation: Thermoplastic ISO 1622-PS,E,085-03 High molecular weight general purpose polystyrene with good mechanical strength. This grade is especially recomme..
Glass Transition Temp, Tg	89.0 °C	192 °F	10°C/min test
Polimeri Europa EDISTIR N1461 Polystyrene (discontinued **) Symbol according to ISO 1043-1: PS Designation: Thermoplastic ISO 1622-PS,M,085-03 High molecular weight general purpose polystyrene with good mechanical strength. Well suitable for injection mold..
Glass Transition Temp, Tg	89.0 °C	192 °F
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc.
Glass Transition Temp, Tg	89.0 °C	192 °F
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Glass Transition Temp, Tg	89.0 °C	192 °F	Unifiltrated; ASTM D3418
ALM PS 200 Prototyping Polymer Non-spherical polystyrene powder for production of complex investment casting patterns.PS-200 can be used as a direct drop in replacement for Castform®, and can be successfully blended with Castfor..
Glass Transition Temp, Tg	89.0 °C	192 °F	Polystyrene; ASTM D3418
3D Systems CastForm™ PS Plastic for SLS® Systems For use with all selective laser sintering (SLS®) systems.ApplicationsCreate patterns directly rather than through indirect methodsComplex investment casting patternsReactive metals like titaniumLo..
Glass Transition Temp, Tg	88.9 °C	192 °F	Tg tan d, Dry, Cured Neat Resin Property, 1 hour @ 70°C/158°F
Hexcel® Redux® 810 Two-Part Epoxy Paste Adhesive Redux® 810 is a multi-purpose, high shear and peel strength, two-part, toughened epoxy paste adhesive with corrosion-inhibiting properties.Features: Available in cartridges with a static mixer and ..