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Polymer Property : Glass Transition Temp, Tg = 104 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 40.0 °C
104 °F
Permabond ET500 Epoxy Resin
PERMABOND ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room tempera..
Glass Transition Temp, Tg 40.0 °C
104 °F
Permabond ET515 Epoxy Resin
PERMABOND® ET515 is a 1:1 mixable epoxy adhesive. ET515 is a semi-flexible toughened adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo..
Glass Transition Temp, Tg 40.0 °C
104 °F
TM R050-25
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Glass Transition Temp, Tg 40.0 °C
104 °F
Humiseal 2A64 Urethane Conformal Coating
Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F..
Glass Transition Temp, Tg 40.0 °C
104 °F
Mallard Creek Polymers ROVENE® 4201 SBR Emulsion
ROVENE® 4201 is a carboxylated styrene-butadiene emulsion that has a stiff or "boardy" hand. This binder is recommended for use as a crosslink-able binder for durable nonwovens such as floor main..
Glass Transition Temp, Tg 40.0 °C
104 °F
Lucite International Elvacite ® 4104 Acrylic Resin
Elvacite® 4104 is designed for use in self-levelling flooring formulations, but can be used in a variety of coatings formulations, such as covercoats, heat seal lacquers and plastic coatings. It ..
Glass Transition Temp, Tg 40.0 °C
104 °F
DSC
Solvay Specialty Polymers Kalix® 2855 Polyamide, High Performance (HPPA), Glass Fiber
Kalix® 2855 is a 27% bio-sourced, PA 6,10-based compound with 55% by weight glass fiber reinforcement. This material is formulated to provide maximum strength, stiffness, impact resistance, and p..
Glass Transition Temp, Tg 40.0 °C
104 °F
Unitika elitel UE3250 Polyester, Pellet
High elongation type UE3240, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as a..
Glass Transition Temp, Tg 40.0 °C
104 °F
Ultimate Tg
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive
TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Glass Transition Temp, Tg 40.0 °C
104 °F
Unitika elitel UE3216 Polyester, Pellet
Low Tg type UE3215UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders, and modi..
Glass Transition Temp, Tg 40.0 °C
104 °F
Ultimate Tg
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive
TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy..
Glass Transition Temp, Tg 40.0 - 48.0 °C
104 - 118 °F
UV Postcure; ASTM E1545-05A
DSM Somos® NeXt LV Grey
The second member of the Somos® NeXt family, Somos® NeXt LV Grey delivers the durability and functionality, with a finer resolution of details and faster part processing. This third-generation, hi..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy
Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy
Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology
Glass Transition Temp, Tg <= 40.0 °C
<= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste
Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Glass Transition Temp, Tg 40.0 °C
104 °F
dry, dynamic; DIN 53 736
Hippe PA 6 G
Thick-wall pre-forms, heavy semi-finished products. Transfusion of inserts (rolls, cores) and all types of large preforms.Information provided by Hippe.
Glass Transition Temp, Tg 40.0 °C
104 °F
DMA, E"
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 250 System
Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 250 system.Typical ApplicationsMulti-purpose modelsRTV mold patternsForm/Fit/..
Glass Transition Temp, Tg 40.0 °C
104 °F
DMA, E"
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 500 System
Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 500 system.All information provided by 3D Systems.
Glass Transition Temp, Tg 40.0 °C
104 °F
Atom Adhesives AA-BOND F125 Epoxy Adhesive
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used ..
Glass Transition Temp, Tg 40.0 °C
104 °F
TM R050-25
Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Glass Transition Temp, Tg 40.0 °C
104 °F
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
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