Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Permabond ET500 Epoxy Resin PERMABOND ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room tempera.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Permabond ET515 Epoxy Resin PERMABOND® ET515 is a 1:1 mixable epoxy adhesive. ET515 is a semi-flexible toughened adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | TM R050-25 |
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Humiseal 2A64 Urethane Conformal Coating Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Mallard Creek Polymers ROVENE® 4201 SBR Emulsion ROVENE® 4201 is a carboxylated styrene-butadiene emulsion that has a stiff or "boardy" hand. This binder is recommended for use as a crosslink-able binder for durable nonwovens such as floor main.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Lucite International Elvacite ® 4104 Acrylic Resin Elvacite® 4104 is designed for use in self-levelling flooring formulations, but can be used in a variety of coatings formulations, such as covercoats, heat seal lacquers and plastic coatings. It .. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DSC |
Solvay Specialty Polymers Kalix® 2855 Polyamide, High Performance (HPPA), Glass Fiber Kalix® 2855 is a 27% bio-sourced, PA 6,10-based compound with 55% by weight glass fiber reinforcement. This material is formulated to provide maximum strength, stiffness, impact resistance, and p.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Unitika elitel UE3250 Polyester, Pellet High elongation type UE3240, Binder paint, Adhesive agentUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as a.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Unitika elitel UE3216 Polyester, Pellet Low Tg type UE3215UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders, and modi.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | Ultimate Tg |
Tra-Con Tra-Bond 862-7 General Purpose Epoxy Adhesive TRA-BOND 862-7 semi-flexible, nonflowing epoxy paste adhesive is designed for general purpose applications. It is suitable for bonding materials with mismatched coefficients of expansion. This epoxy.. |
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Glass Transition Temp, Tg | 40.0 - 48.0 °C | 104 - 118 °F | UV Postcure; ASTM E1545-05A |
DSM Somos® NeXt LV Grey The second member of the Somos® NeXt family, Somos® NeXt LV Grey delivers the durability and functionality, with a finer resolution of details and faster part processing. This third-generation, hi.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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Glass Transition Temp, Tg | >= 40.0 °C | >= 104 °F | |
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology |
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Glass Transition Temp, Tg | <= 40.0 °C | <= 104 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | dry, dynamic; DIN 53 736 |
Hippe PA 6 G Thick-wall pre-forms, heavy semi-finished products. Transfusion of inserts (rolls, cores) and all types of large preforms.Information provided by Hippe. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DMA, E" |
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 250 System Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 250 system.Typical ApplicationsMulti-purpose modelsRTV mold patternsForm/Fit/.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | DMA, E" |
3D Systems Accura® accuGen™ HC and Ar Plastic for the SLA® 500 System Our most versatile material combines accuracy, green strength, and build chamber environment independence. For the SLA® 500 system.All information provided by 3D Systems. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used .. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | TM R050-25 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Glass Transition Temp, Tg | 40.0 °C | 104 °F | |
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |