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Polymer Property : Melting Point = 361 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Melting Point | 183 °C | 361 °F | DSC, both heating and cooling speeds of 10°C/min |
| Noltex Soarnol® DC3203F Ethylene Vinyl Alcohol Copolymer Low ethylene content. Suitable for use in packaging material used at normal temperature and humidity. Ethylene content 32 mol%. Volatile matter 0.3%.Information provided by Soarus, LLC. In the Un.. |
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| Melting Point | 183 °C | 361 °F | DSC, both heating and cooling speeds of 20°C/min |
| Noltex Soarnol® ST110 Ethylene Vinyl Alcohol Copolymer Modified DC3203; improved flex crack resistance and thermoformability. Ethylene content 32 mol%. Volatile matter 0.3%.The gas barrier property of Soarnol is about forty times better than that of n.. |
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| Melting Point | 183 °C | 361 °F | Fisher-Johns test |
| DuPont Selar® RB 421 EVOH Barrier Resin
(discontinued **) Selar® RB 421 barrier resin is a pellet blend of EVOH (ethylene vinyl alcohol) and a proprietary adhesive for EVOH and polyethylene.Selar® RB 421 has been designed for use in blends with polyethyl.. |
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| Melting Point | 183 - 187 °C | 361 - 369 °F | |
| Hong Kun Group AO 168 Antioxidant CAS No. 31570-04-4All information provided by Hongkun Group |
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| Melting Point | 183 - 268 °C | 361 - 514 °F | |
| Indium Corp. Indalloy 145 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 288 °C | 361 - 550 °F | |
| Indium Corp. Indalloy 153 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 °C | 361 °F | |
| Lucas-Milhaupt 63 Sn-37 Pb Tin/ Silver Solder Characteristics:Although widely used in electronics for both manual and automatic soldering applications, it is also used in general purpose applications where fast alloy flow is desired. This allo.. |
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| Melting Point | 183 - 191 °C | 361 - 376 °F | |
| Indium Corp. Indalloy 109 Tin-Lead Solder Alloy Good electrical grade solderInformation Provided by Indium Corporation |
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| Melting Point | 183 - 192 °C | 361 - 378 °F | |
| Indium Corp. Indalloy 110 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 199 °C | 361 - 390 °F | |
| Indium Corp. Indalloy 112 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 205 °C | 361 - 401 °F | |
| Indium Corp. Indalloy 114 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 212 °C | 361 - 414 °F | |
| Indium Corp. Indalloy 116 Tin-Lead Solder Alloy General purpose solderInformation Provided by Indium Corporation |
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| Melting Point | 183 - 218 °C | 361 - 424 °F | |
| Indium Corp. Indalloy 120 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 - 247 °C | 361 - 477 °F | |
| Indium Corp. Indalloy 135 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 °C | 361 °F | |
| Johnson Matthey JM6337 Soft Solder/Flux General information on the Johnson Matthey soft solder and flux product line: A wide range of Tin/Lead solders suitable for a variety of applications is available from Johnson Matthey. Most materi.. |
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| Melting Point | 183 - 187 °C | 361 - 369 °F | |
| Suqian Unitechem Antioxidant 168 Chemical Name: Tris-(2,4-di-tert-butyl-phenyl)-phosphiteCAS NO.: 31570-04-4Molecular Formula: C42H63O3PProperties: The product takes on an appearance of white powder, without odor and smell. Solubl.. |
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| Melting Point | 183 °C | 361 °F | |
| Williams Advanced Alloys WS183 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 189 °C | 361 - 372 °F | |
| Williams Advanced Alloys WS199 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 212 °C | 361 - 414 °F | |
| Williams Advanced Alloys WS212 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 213 °C | 361 - 415 °F | |
| Williams Advanced Alloys WS213 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 257 °C | 361 - 495 °F | |
| Williams Advanced Alloys WS257 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | 183 - 280 °C | 361 - 536 °F | |
| Williams Advanced Alloys WS280 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| Melting Point | <= 183 °C | <= 361 °F | Peak Melting Point; ExxonMobil method |
| ExxonMobil Escorene™ FL 00119 Ethylene Vinyl Acetate Copolymer (European Grade) Product Description: FL 00119 is a copolymer of ethylene and vinyl acetate offering low gel. Availability: Africa & Middle East and Europe Additive: Antiblock: NoSlip: NoThermal Stabilizer: Yes Ap.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BMN Y TLD Nylon 11, MoS2 Filled (Dry) Designation ISO 1874-PA11,MHLR,12-020,MD05Rigid grade with molybdenum filler for injection molding. Available color: steel gray. Light and heat stabilized. Mold release agent.No need of lubricant. L.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BZM 23 G9 Nylon 11, 23% Glass Fiber Filled (Dry) Designation ISO 1874-PA11,MS,18-040,(G+C)(F+D)(25+05)Rigid grade with glass fiber (23%) and graphite filler for injection molding. Available color: steel black gray. Additive free.Rigidity. Low fric.. |
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| Melting Point | 183 °C | 361 °F | 10°C/min |
| Arkema Group Rilsan® BZM 30 TL Nylon 11, 30% Glass Fiber Filled (Dry) Designation ISO 1874-PA11,MHL,18-050,GF30Rigid grade with glass fiber (30%) filler for injection molding. Available colors: black and natural. Light and heat stabilized.Rigidity. High compressive st.. |
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| Melting Point | 183 °C | 361 °F | |
| AIM 63Sn/Pb37 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| Melting Point | 183 °C | 361 °F | ASTM D3417- ISO 3146 |
| DuPont Surlyn® PC2000
(discontinued **) DuPont™ Surlyn® PC2000 thermoplastic resin is an advanced ethylene/methacrylic acid (E/MAA) copolymer, in which the MAA acid groups have been partially neutralized with sodium ions. The high MAA c.. |
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| Melting Point | 183 - 184 °C | 361 - 363 °F | |
| Indium Corp. Indalloy 107 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| Melting Point | 183 °C | 361 °F | DSC |
| EVALCA EVAL® LC-T101 Ethylene Vinyl Alcohol Copolymer Resin
(discontinued **) 32 mol % Ethylene.Data provided by EVALCA. Applications: Solid phase pressure forming. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produc.. |
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