Thermal Properties | Metric | English | Comments |
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Melting Point | 275 - 302 °C | 527 - 576 °F | |
Indium Corp. Indalloy 242 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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Melting Point | 275 - 302 °C | 527 - 576 °F | |
Indium Corp. Indalloy® 159 Pb-Sn Solder Alloy High temp solder for BGA applications.Information provided by the manufacturer, Indium Corporation. |
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Melting Point | 275 - 302 °C | 527 - 576 °F | |
Williams Advanced Alloys WS302 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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Melting Point | <= 275 °C | <= 527 °F | Peak Melting Point; ExxonMobil method |
ExxonMobil HDPE HD 6909.19 High Density Polyethylene Copolymer Resin Product Description: HD 6908 is a homopolymer with outstanding stiffness with a good balance of processability and cold temperature impact performance. This resin is ideally suited for articles requ.. |
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Melting Point | <= 275 °C | <= 527 °F | Peak Melting Point; ExxonMobil method |
ExxonMobil HDPE HD 6909.65 High Density Polyethylene Copolymer Resin Product Description: HD 6908 is a homopolymer with outstanding stiffness with a good balance of processability and cold temperature impact performance. This resin is ideally suited for articles requ.. |
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Melting Point | 275 - 285 °C | 527 - 545 °F | |
Solvay RHODAPHOSE® BINAP (RACEMIC) Phosphorus Derivative Identification: 2,2’-BIS(DIPHENYLPHOSPHINO)-1,1’-BINAPHTHYLCAS: 98327 – 87 – 8Available in: Asia Pacific, Europe, Latin America and North America Applications: BINAP (RACEMIC) is a bulky phosphi.. |