Polymer Property : Melting Point = 1080 °C Product List

Thermal Properties

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Thermal Properties	Metric	English
Melting Point	1080 - 1135 °C	1980 - 2075 °F
Osprey Metals HTN 5 Brazing Powder Particle size distribution 1-250 microns.SHAPE: Predominantly spherical PACKAGING: 4 & 20 Kg. Chemical composition and particle size distribution can be adjusted to suit customers' requireme..
Melting Point	1080 °C	1980 °F
CLAL-MSX CUPROROR® TL1 1/4 hard, Copper Alloy Alloy especially suited to applications in electronics and electro technology. This doped copper, displays high electrical and thermal conductivity, good mechanical properties and excellent temperat..
Melting Point	1080 °C	1980 °F
CLAL-MSX CUPROROR® TL2 1/2 hard, Copper Alloy Alloy especially suited to applications in electronics and electro technology. This doped copper, displays high electrical and thermal conductivity, good mechanical properties and excellent temperat..
Melting Point	1080 °C	1980 °F
CLAL-MSX CUPROROR® TL5 Spring, Copper Alloy Alloy especially suited to applications in electronics and electro technology. This doped copper, displays high electrical and thermal conductivity, good mechanical properties and excellent temperat..
Melting Point	1080 °C	1980 °F
CMW® DSC Copper with Dispersed Aluminum Oxide CMW® DSC material is an extruded and cold worked powder metallurgy material consisting of copper and dispersed aluminum oxide. It has exceptional high temperature strength for its electrical conduc..
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 2140C Copper Tungsten Nickel material For structural rotors.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 30W3 Infiltrated Copper Tungsten contact material ASTM B702, Class E, infiltrated, RWMA Class 12 For projection welding dies, die facing, and resistance welding electrodes. Also used for low expansion structural members. Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 3W3 Tungsten Copper material ASTM B702 For arcing and current carrying electrical contacts, power transformer contacts, resistance welding electrodes.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 3W53 Heat Treatable Tungsten Copper material For resistance welding electrodes.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 40W3 Infiltrated Tungsten Copper material ASTM B702 For vacuum switch contacts, low expansion structural members.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 50W3 Tungsten Copper material ASTM B702 For vacuum switch contacts.Information provided by CMW Inc.
Melting Point	1080 °C	1980 °F
CLAL-MSX CUPROROR® TL4 Hard, Copper Alloy Alloy especially suited to applications in electronics and electro technology. This doped copper, displays high electrical and thermal conductivity, good mechanical properties and excellent temperat..
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® ELKONITE® 5W3 Tungsten Copper material ASTM B702, Class C, infiltrated For arcing and current carrying electrical contacts; power transformer contacts.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® THERMKON® 62 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 2610 °C	1980 - 4730 °F
CMW® THERMKON® 65M Molybdenum Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 2610 °C	1980 - 4730 °F
CMW® THERMKON® 68 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 2610 °C	1980 - 4730 °F
CMW® THERMKON® 70M Molybdenum Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® THERMKON® 76 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 3410 °C	1980 - 6170 °F
CMW® THERMKON® 83 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Melting Point	1080 - 1260 °C	1980 - 2300 °F
Kennametal Stellite Nucalloy® 430 High-Silicon Nickel-Base Hardfacing Alloy Applications include components of chemical processing.Nucalloy® alloys are unique, patented, high-silicon, nickel-base hardfacing alloys that are designed to have optimum combinations of hardness ..