Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Shear Strength | 11.83 MPa | 1716 psi | Lap |
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |