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Polymer Property : Tensile Modulus = 640 ksi Product List
Mechanical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Modulus | 4.41 GPa | 640 ksi | ASTM D638 |
| Quadrant EPP Semitron® MP-370 (ASTM Product Data Sheet) |
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| Tensile Modulus | 4.41 GPa | 640 ksi | Type I, 5.1 mm/min; ASTM D638 |
| PolyOne Edgetek® X TR2-20GF/000 NATURAL Copolyester The Edgetek™ engineering thermoplastics compounds made with Eastman Tritan™ copolyester offer a wide range of performance and properties with the addition of reinforcing additives. By utilizing Ea.. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 1 mm/min; ISO 527 |
| SABIC Innovative Plastics LNP Lubricomp DFP22H PC LNP* Lubricomp* DFP22H is a compound based on Polycarbonate containing Glass Fiber and PTFE. Characteristics of this grade are: Internally Lubricated and Healthcare.This data was supplied by SABIC.. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 50 mm/min; ASTM D638 |
| SABIC Innovative Plastics LNP LUBRICOMP DFL42 PC LNP* Lubricomp* DFL-4042 a compound based on Polycarbonate resin containing 10% Glass Fiber, 20% PTFE. Added features include: Internally Lubricated. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 1 mm/min; ISO 527 |
| SABIC Innovative Plastics LNP THERMOCOMP DFZ22P PC (Asia Pacific) LNP* THERMOCOMP* DFZ22P is a compound based on Polycarbonate resin containing Glass Fiber, Milled Glass. Added features of this material include: Exceptional Processing. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 5 mm/min; ASTM D638 |
| Samsung Cheil Industries Infino® GP-5150GT PBT, 15% Glass Filled Low warpage with 15% GF reinforcement and can be used in the switches for microwave or ovensInformation provided by Samsung Cheil Industries. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 5 mm/min; ASTM D638 |
| Samsung Cheil Industries Infino® GP-5150GT PBT, 15% Glass Filled Low warpage with 15% GF reinforcement and can be used in the switches for microwave or ovensInformation provided by Samsung Cheil Industries. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 1 mm/min; ISO 527 |
| SABIC Innovative Plastics LNP THERMOCOMP DFZ22P PC LNP THERMOCOMP* DFZ22P is a compound based on Polycarbonate resin containing 10% Glass Fiber, 10% Milled Glass. Added features of this material include: Exceptional Processing. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 1 mm/min; ISO 527 |
| SABIC Innovative Plastics LNP THERMOCOMP NF002 PC+ABS LNP THERMOCOMP* NF002 is a compound based on PC+ABS resin containing 10% Glass Fiber. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | ASTM D638 |
| Ensinger Tecapeek® XP-102 Compression Molded PEEK Compound, Filled with 15% Graphite and 10% PTFE Ensinger Special Polymers offers over twenty different VICTREX® PEEK blends to choose from and has the capability to blend custom compounds for specific applications. Compression molding results in.. |
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| Tensile Modulus | 4.42 GPa | 640 ksi | Storage |
| Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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| Tensile Modulus | 4.41 GPa | 640 ksi | 1 mm/min; ISO 527 |
| SABIC Innovative Plastics LNP THERMOTUF VX99810 Super Tough Nylon Super Tough Nylon, Proprietary Filler(s), |
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| Tensile Modulus | 4.41 GPa | 640 ksi | ASTM D638 |
| Quadrant EPP Semitron® ESd 420- CM Dissipative Polyetherimide(ASTM Product Data Sheet) |
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