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Polymer Property : Tensile Modulus = 619 ksi Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Tensile Modulus 4.27 GPa

@Thickness 6.40 mm
619 ksi

@Thickness 0.252 in
ASTM D638
SABIC Innovative Plastics Lexan® FL920 PC
Various weight reductions at .250"" (6.35 mm) wall, 20% GR. Excellent flex mod, high tensile strength/heat resistance. V-0/5V at .250"" (6.35mm).
Tensile Modulus 4.27 GPa

@Thickness 6.40 mm
619 ksi

@Thickness 0.252 in
ASTM D638
SABIC Innovative Plastics Lexan® FL920 PC (Asia Pacific)
Various weight reductions at .250"" (6.35 mm) wall, 20% GR. Excellent flex mod, high tensile strength/heat resistance. V-0/5V at .250"" (6.35mm).
Tensile Modulus 4.27 GPa
619 ksi
5 mm/min; ASTM D 638
SABIC Innovative Plastics Ultem 2212 PEI
20% Milled glass filled, enhanced flow Polyetherimide (Tg 217C). ECO Conforming, UL94 V0 and 5VA listing.This data was supplied by SABIC-IP for the Americas region.
Tensile Modulus 4.27 GPa
619 ksi
5 mm/min; ASTM D 638
SABIC Innovative Plastics Ultem 2212 PEI (Asia Pacific)
20% Milled glass filled, enhanced flow Polyetherimide (Tg 217C). ECO Conforming, UL94 V0 and 5VA listing.This data was supplied by SABIC-IP for the Asia Pacific region.
Tensile Modulus 4.27 GPa
619 ksi
5 mm/min; ASTM D638
SABIC Innovative Plastics ULTEM 2212R PEI
20% Milled glass filled, enhanced flow Polyetherimide (Tg 217C) with internal mold release. ECO Conforming, UL94 V0 and 5VA listing.
Tensile Modulus 4.27 GPa
619 ksi
5 mm/min; ASTM D638
SABIC Innovative Plastics ULTEM 2212R PEI (Asia Pacific)
20% Milled glass filled, enhanced flow Polyetherimide (Tg 217C) with internal mold release. ECO Conforming, UL94 V0 and 5VA listing.
Tensile Modulus 4.27 GPa
619 ksi
50 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP DFZ22P PC (Asia Pacific)
LNP* THERMOCOMP* DFZ22P is a compound based on Polycarbonate resin containing Glass Fiber, Milled Glass. Added features of this material include: Exceptional Processing.
Tensile Modulus 4.27 GPa
619 ksi
50 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP DFZ22P PC
LNP THERMOCOMP* DFZ22P is a compound based on Polycarbonate resin containing 10% Glass Fiber, 10% Milled Glass. Added features of this material include: Exceptional Processing.
Tensile Modulus 4.27 GPa
619 ksi
Hexcel® HexPly® F263 Epoxy Resin
HexPly® F263 is a structural, heat resistant epoxy resin formulated for excellent translation of high modulus carbon fiber properties in typically aerospace applications. HexPly® F263 is a high te..
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