Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 4.19 GPa | 608 ksi | Storage |
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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Tensile Modulus | 4.19 GPa | 608 ksi | ASTM D882A |
DuPont Teijin Films Mylar® HP Polyester Film, 92 Gauge Mylar® HP film is a high strength, high clarity and low haze polyester film with dimensional stability particularly suitable for use in applications where dimensional stability is a requirement dur.. |