Polymer Property : Tensile Modulus = 375 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	2.59 GPa	375 ksi	chs 2 in/min; ASTM D638
Network Polymers NPS 80-0201 Crystal Polystyrene Description: Injection Molding Grade, High Heat ResistantInformation provided by Network Polymers Inc.
Tensile Modulus	2.59 GPa	375 ksi	ASTM D638
Ravago Manufacturing Americas Hylac® HF224 ABS Entec's proprietary products include a full range of compounds in the Nylon 6/6, Nylon 6, ABS, PBT, Polycarbonate, PC/ABS, PC/ASA, PC/PBT, and PPO/PPE resin families.Information provided by Rava..
Tensile Modulus	2.59 GPa	375 ksi	ASTM D638
Ravago Manufacturing Americas Hylac® PL75 ABS Entec's proprietary products include a full range of compounds in the Nylon 6/6, Nylon 6, ABS, PBT, Polycarbonate, PC/ABS, PC/ASA, PC/PBT, and PPO/PPE resin families.Information provided by Rava..
Tensile Modulus	2.59 GPa	375 ksi	Type 1 - Rigids, 0.2 in/min; ASTM D638
PolyOne Lubri-Tech™ SY-000/10T-2S Natural Polystyrene (PS), PTFE Lubricated (discontinued **) Description/Features:High ImpactPTFE LubricatedInformation provided by PolyOne Corporation.
Tensile Modulus	2.59 GPa	375 ksi	Type 1 - Rigids, 0.2 in/min; ASTM D638
PolyOne Lubri-Tech™ NL-15GM/15T Nylon 6/12, Glass Filled, PTFE Lubricated (discontinued **) Description/Features:Milled Glass Fiber ReinforcedPTFE LubricatedUL 94 HBPolyOne First ChoiceInformation provided by PolyOne Corporation.
Tensile Modulus	2.59 GPa	375 ksi	ASTM D-882
Saint-Gobain NortonÂ® High Performance Extruded PEI Film Description: PEI = polyetherimide. Used Primarily for Electrical/Electronics ApplicationsInformation provided by Saint Gobain Performance Products.
Tensile Modulus	2.59 GPa	375 ksi	Storage
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Tensile Modulus	2.59 GPa	375 ksi	Storage
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Tensile Modulus	2.59 GPa @Temperature 130 °C	375 ksi @Temperature 266 °F	DAM; Dynamic; ISO 11403-1 -2
DuPont Performance Polymers Minlon® EFE6053 BK413 Nylon 66 (Unverified Data**) 40% Mineral/Glass Reinforced Polyamide 66 Minlon EFE6053 BK413 is a 40% mineral/glass reinforced heat stabilized polyamide 66 resin for injection molding.Information provided by DuPont Performance P..
Tensile Modulus	2.59 GPa	375 ksi	ASTM D-638
Axiall ProTherm® 4303 Rigid PVC, Extrusion Georgia Gulf 4303 is a CPVC powder formulation designed for the processing of pipe products with an O.D. range of 1/2" to 8 inches requiring high heat deflection temperatures. Processing and stabil..
Tensile Modulus	2.59 - 3.28 GPa	375 - 475 ksi	ASTM D638
Cast Nylons Nycast® GX Solid Lubricant Filled Gray Cast Nylon 6 NYCAST® GX is a specially formulated, self-lubricating grade designed to deliver low coefficient of friction, superior wear resistance, high pressure/velocity performance, and low moisture absorpti..
Tensile Modulus	2.59 - 3.28 GPa	375 - 475 ksi	ASTM D638
Cast Nylons Nycast® RX Solid Lubricant Filled Red Cast Nylon 6 NYCAST® RX is a specially formulated, self-lubricating grade designed to deliver low coefficient of friction, superior wear resistance, high pressure/velocity performance, and low moisture absorpti..
Tensile Modulus	2.59 GPa	375 ksi	ASTM D-638
Axiall 9153 Rigid PVC, Molding Georgia Gulf 9153 is an excellent combination of chemical resistance, impact and processing for chemically active products, such as pine oil cleaners.Information provided by Georgia GulfGeorgia Gulf..
Tensile Modulus	2.59 GPa	375 ksi	TM R050-36
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Tensile Modulus	2.59 GPa	375 ksi	TM R050-36
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..