Polymer Property : Tensile Modulus = 312 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	2.15 GPa	312 ksi	Type I, 5.1 mm/min; ASTM D638
PolyOne Geon™ Vinyl Rigid Extrusion L0676 Polyvinyl Chloride, Rigid (PVC, Rigid) Note: NSF listings are obtained on specific colors. Contact PolyOne for the latest listing of approved colors for this product. Note: The Cell Classification was determined using the notched Izod te..
Tensile Modulus	2.15 GPa	312 ksi	5 mm/min; ASTM D638
SABIC Innovative Plastics Cycoloy® CY100FC PC+ABS (Asia Pacific) High impact PC+ABS material designed for local Pacific Automotive applications
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4301 PPC+PC (Europe-Africa-Middle East) Lexan 4301 is a high heat resistant poly (ester) carbonate resin for injection moldingThis data was supplied by SABIC-IP for the Europe-Africa-Middle East region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4401R PPC+PC (Asia Pacific) LEXAN 4401R is a high heat resistant poly(ester)carbonate injection molding resin.This data was supplied by SABIC-IP for the Asia Pacific region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4404 PPC+PC High heat polycarbonate copolymer, with HDT of 287F at 264 psi. FDA food contact compliant. Effective Jan 15th, 2008 this grade should not be used for medical applications which require biocompatibi..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4404 PPC+PC (Asia Pacific) High heat polycarbonate copolymer, with HDT of 287F at 264 psi. FDA food contact compliant. Effective Jan 15th, 2008 this grade should not be used for medical applications which require biocompatibi..
Tensile Modulus	2.15 GPa	312 ksi
Radici Radilon® CST (cond.) Nylon 6/66 Radilon® CS is a range of polyamide 6/66 copolymers obtained through the polymerization of caprolactam and hexamethylendiamine salt with adipic acid.Information provided by Radici group.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1444 PC Copolymer Lexan* EXL1444 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade suitable for FDA compliant applications. This resin offers extreme low temperature (-..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1444 PC Copolymer (Europe-Africa-Middle East) Lexan* EXL1444 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade suitable for FDA compliant applications. This resin offers extreme low temperature (-..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810 PC Copolymer Non-chlorinated, non-brominated Flame retardant PC-siloxane copolymer blend. Excellent processability, super high flow, good impact, UL rated V-0. Limited translucent colors.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810 PC Copolymer (Asia Pacific) Non-chlorinated, non-brominated Flame retardant PC-siloxane copolymer blend. Excellent processability, super high flow, good impact, UL rated V-0. Limited translucent colors.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXE1414 PC Copolymer Lexan* FXE1414 polycarbonate (PC) siloxane copolymer resin is a special effects fluorescent, medium flow opaque injection molding (IM) grade. This resin offers extreme low temperature (-40 C) ductil..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HFD1232 PC Copolymer (Europe-Africa-Middle East) 18 MFR LEXAN High Flow Ductile Copolymer UV-stabilized, available in transparent colors only
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HPH4404 PPC+PC (Asia Pacific) High heat specialty polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, gamma and e-beam steril..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7647 PC Non FR Impact modified PC, excellent Fatigue performance with balanced Flow and impact. Available in Opaque onlyThis data was supplied by SABIC-IP for the Americas region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7647 PC (Asia Pacific) Non FR Impact modified PC, excellent Fatigue performance with balanced Flow and impact. Available in Opaque only
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® ML7666 PC (Asia Pacific) Non FR Impact modified PC, excellent Fatigue performance with balanced Flow and impact. Available in Opaque onlyThis data was supplied by SABIC-IP for the Asia Pacific region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7689 PC Copolymer (Asia Pacific) Lexan* ML7689 polycarbonate (PC) siloxane copolymer resin IS a high viscosity injection molding (IM) grade WITH good processability, offering opportunities FOR shorter IM CYCLE times compared TO sta..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7689 PC Copolymer (Europe-Africa-Middle East) Lexan* ML7689 polycarbonate (PC) siloxane copolymer resin IS a high viscosity injection molding (IM) grade WITH good processability, offering opportunities FOR shorter IM CYCLE times compared TO sta..
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics LNP LUBRICOMP AL004 ABS (Asia Pacific) LNP* Lubricomp* AL004 is a compound based on Acrylonitrile Butadiene Styrene resin containing Lubricants. Added features of this material include: Internally Lubricated.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4301 PPC+PC Lexan 4301 is a high heat resistant poly (ester) carbonate resin for injection moldingThis data was supplied by SABIC-IP for the Americas region.
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL8414 PC Copolymer (Asia Pacific) Lexan* EXL8414 is a PC/siloxane copolymer resin with medium flow, excellent low temperature impact and 25% post consumer recycle content. Limited availability and restricted color only. Higher color..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810U PC Copolymer (Asia Pacific) Polycarbonate with high flow, excellent processability, good impact and thermal properties, UV stabilized, non-Chlorine and non-Bromine flame retardant, UL rated V-0 and V-1. Available in limited di..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HFD1262 PC Copolymer 19 MFR LEXAN High Flow Ductile Copolymerwith 400 nm cut off, available in transparent colors only
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HPH4404 PPC+PC High heat specialty polycarbonate. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO10993 or USP Class VI). EtO, steam, gamma and e-beam steril..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics XenoyÂ® CL100 PBT+PC Xenoy CL100 is an unfilled, impact modified, UV-stabilized PC/PBT blend with excellent solvent resistance and good low-temperature ductility. It has a proven track record in unpainted exterior autom..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics XenoyÂ® X5100 PC+PBT (Europe-Africa-Middle East) XENOY X5100 is a semi-crystalline, impact modified PC-PBT blend with excellent flow. (PC+PBT-I).
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics LNP STAT-LOY NX03583 PC+ABS LNP STAT-LOY* NX03583 is a compound based on PC+ABS Blend resin. Added features of this material include: Antistat, Flame Retardant.
Tensile Modulus	2.15 GPa	312 ksi	Storage
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..