Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 3.96 GPa | 574 ksi | Type I, 5.1 mm/min; ASTM D638 |
PolyOne Stat-Tech™ AS-15CF/000 Acrylonitrile Butadiene Styrene (ABS) Stat-Tech™ Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compound.. |
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Tensile Modulus | 3.96 GPa | 574 ksi | ASTM D638 |
Proto3000 Duraform® AF Selective Laser Sintering (SLS®) Prototyping Polymer Description: Polyamide (nylon) material with metallic appearance for real-world physical testing and functional use.Features:Metallic appearance with nice surface finishGood powder recycle character.. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics Lexan® BFL2010 PC Non-brominated, non-chlorinated flame retardant, glass reinforced PC with improved flow. Available in opaque colors. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics Lexan® BFL2010 PC (Asia Pacific) Non-brominated, non-chlorinated flame retardant, glass reinforced PC with improved flow. Available in opaque colors. |
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Tensile Modulus | 3.96 GPa | 575 ksi | ASTM D638 |
Quadrant EPP Duratron® PAI T4540 Polyamide-imide, compression molded (ASTM Product Data Sheet) |
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Tensile Modulus | 3.96 GPa | 574 ksi | 5 mm/min; ASTM D638 |
SABIC Innovative Plastics Lexan® BFL2010 PC (Europe-Africa-Middle East) Non-brominated, non-chlorinated flame retardant, glass reinforced PC with improved flow. Available in opaque colors. |
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Tensile Modulus | 3.96 GPa | 575 ksi | ASTM D638 |
Quadrant EPP Semitron® CMP XL20 (ASTM Product Data Sheet) |
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Tensile Modulus | 3.96 GPa | 574 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP KZ004 Acetal Copolymer LNP THERMOCOMP* KZ004 is a compound based on Acetal Copolymer resin containing 20% Milled Glass. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP KZ004 Acetal Copolymer (Asia Pacific) LNP* THERMOCOMP* KZ004 is a compound based on Acetal Copolymer resin containing Glass Fiber, Milled Glass. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP DB008ERP PC LNP* THERMOCOMP* DB008ERP is a compound based on Polycarbonate resin containing 40% Glass Bead. Added features of this material include: Easy Molding, Mold Release. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 50 mm/min; ASTM D638 |
SABIC Innovative Plastics LNP THERMOCOMP DB008ERP PC (Asia Pacific) LNP* Thermocomp* DB008ERP is a compound based on Polycarbonate resin containing Glass Bead. Added features of this material include: Easy Molding, Mold Release. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 50 mm/min; ASTM D 638 |
SABIC Innovative Plastics LNP Thermocomp DF002L PC (Asia Pacific) LNP* THERMOCOMP* DF002L is a compound based on Polycarbonate resin containing Glass Fiber. Added features of this material include: Low Extractible.This data was supplied by SABIC-IP for the Asia P.. |
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Tensile Modulus | 3.96 GPa | 574 ksi | 1 mm/min; ISO 527 |
SABIC Innovative Plastics LNP THERMOCOMP RB004 PA 66 LNP* THERMOCOMP* RB004 is a compound based on Nylon 66 containing Glass Beads. |
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Tensile Modulus | 3.96 GPa | 574 ksi | ASTM D638 |
3D Systems DuraForm® AF Nylon for SLS® Systems Polyamide (nylon) material with metallic appearance for real-world physical testing and functional use. For use with all selective laser sintering SLS® systems.ApplicationsHousings and enclosuresCo.. |