Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 7.632 GPa | 1107 ksi | Storage |
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
|||
Tensile Modulus | 7.632 GPa | 1107 ksi | Storage |
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
|||
Tensile Modulus | 7.634 GPa @Temperature -10.0 °C |
1107 ksi @Temperature 14.0 °F |
Dynamic; ISO 11403-1 -2 |
DuPont Performance Polymers Crastin® LW9020 NC010 PBT+ASA
(Unverified Data**) 20% Glass Reinforced Polybutylene Terephthalate Blend with Low Warpage Characteristics Crastin LW9020 NC010 is a 20% glass fiber reinforced polybutylene terephthalate blend for injection molding. .. |