Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Tensile Modulus = 1.71 GPa Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Mechanical Properties Metric English Comments
Tensile Modulus 1.71 GPa
248 ksi
50 mm/min; ASTM D638
SABIC Innovative Plastics NORYL WCV072 PPE+PP (Asia Pacific)
Flexible, halogen free mPPE extrusion grade material for applications such as automotive wire insulation. Low specific gravity with good flame retardant and very good scrape abrasion resistance. De..
Tensile Modulus 1.71 GPa
248 ksi
50 mm/min; ASTM D638
SABIC Innovative Plastics NORYL WCV072 PPE+PP (Europe-Africa-Middle East)
Flexible, halogen free mPPE extrusion grade material for applications such as automotive wire insulation. Low specific gravity with good flame retardant and very good scrape abrasion resistance. De..
Tensile Modulus 1.71 GPa
248 ksi
5 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP V1000SU PA
LNP* Thermotuf* V1000SU is a compound based on Nylon resin. Added features of this material include: Heat Stabilized, UV Stabilized.
Tensile Modulus 1.71 GPa
248 ksi
5 mm/min; ASTM D638
SABIC Innovative Plastics LNP THERMOCOMP V1000UXC PA
LNP* Thermotuf* V1000UXC is a compound based on Nylon resin. Added features of this material include: UV Stabilized.
Tensile Modulus 1.71 GPa
248 ksi
50 mm/min; ASTM D638
SABIC Innovative Plastics NORYL WCV072 PPE+PP
Flexible, halogen free mPPE extrusion grade material for applications such as automotive wire insulation. Low specific gravity with good flame retardant and very good scrape abrasion resistance. De..
Tensile Modulus 1.71 GPa
249 ksi
Storage
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive
Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..
Copyright © lookpolymers.com All Rights Reserved