Polymer Property : Tensile Modulus = 1.57 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	1.57 GPa	228 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® FXE173R PC This data was supplied by SABIC-IP for the Americas region.
Tensile Modulus	1.57 GPa	228 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® SFX173RU PC SFX173RU is a transparent SecurFX grade with high flow, mold release and UV stabilizer. This grade is for security applications and contains proprietary authentication technology.
Tensile Modulus	1.57 GPa	228 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® SFX173RU PC (Asia Pacific) SFX173RU is a transparent SecurFX grade with high flow, mold release and UV stabilizer. This grade is for security applications and contains proprietary authentication technology.
Tensile Modulus	1.57 GPa	228 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics LNP STAT-KON MX01767C PP LNP* STAT-KON* MX01767C is a compound based on Polypropylene containing Proprietary Filler(s). Added features of this grade include: Electrically Conductive, Clean Compounding System.
Tensile Modulus	1.57 GPa	228 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics LNP STAT-KON MX10301C PP LNP* STAT-KON* MX10301C is a compound based on Polypropylene containing Proprietary Filler(s). Added features of this grade include: Electrically Conductive, Clean Compounding System.
Tensile Modulus	1.57 GPa	228 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® SD-0170 F ABS, Unreinforced Information provided by Samsung Cheil Industries.
Tensile Modulus	1.57 GPa	228 ksi	5 mm/min; ASTM D638
Samsung Cheil Industries StarexÂ® SD-0170 F ABS, Unreinforced Information provided by Samsung Cheil Industries.
Tensile Modulus	1.57 GPa	228 ksi	Film M.D.; ASTM D882
Eastman Eastman Embrace Copolyester for Extrusion/Cast Film Applications:Flexible packagingIV containersLabels to fit high contour containersShrink packagingWrap around designKey Attributes:Excellent clarityExcellent printabilityGood chemical resistanceGood ..
Tensile Modulus	1.57 GPa	228 ksi	Storage
Epoxy Technology EPO-TEK® B912-8 Epoxy Product Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot..
Tensile Modulus	1.57 GPa	227 ksi	ASTM D-638
Axiall Suprel® SVA 9420 Rigid PVC, Molding Georgia Gulf Suprel® SVA 9420 Alloy is engineered for injection molding applications that require outstanding impact resistance or toughness, particularly at low temperatures. This alloy complies ..
Tensile Modulus	1.57 GPa	228 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics LNP Stat-kon MX01767C PP LNP* Stat-Kon* MX01767C is a compound based on Polypropylene containing Proprietary Fillers. Charactiers of this grade are Statically Conductive, Clean Compound System.This data was supplied by SAB..