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Polymer Property : Tensile Modulus = 0.414 GPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Tensile Modulus 0.414 GPa
60.0 ksi
TM R050-36
Resinlab® EP1112NC Clear Electronic Grade Epoxy Encapsulant
Resinlab™ EP1112NC Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Clear is a modified version of the standard EP11..
Tensile Modulus 0.414 GPa
60.0 ksi
TM R050-36
Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant
Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11..
Tensile Modulus 0.414 - 0.552 GPa
60.0 - 80.0 ksi
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Tensile Modulus 0.414 - 0.552 GPa
60.0 - 80.0 ksi
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works.
Tensile Modulus 0.414 - 0.552 GPa
60.0 - 80.0 ksi
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Tensile Modulus 0.414 - 0.552 GPa
60.0 - 80.0 ksi
ITW Plexus Plexusâ„¢ MA1025 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, able to be used 1" thick.Information provided by Illinois Tool Works.
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Chemfilm® DF100 Fluoropolymer Cast Film
Description: Used for Chemical Process, Electrical/Electronics, Medical, Protective/Decorative. Surface Treatments Available: Chemical Etching (1 or 2 sides). Information provided by Saint Gobain Pe..
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Chemfilm® DF110 Fluoropolymer Cast Film
Description: Used for Chemical Process, Electrical/Electronics, Medical, Protective/Decorative.Information provided by Saint Gobain Performance Products.
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1400 Non-Conductive PTFE Tape
Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super..
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1471 Conductive PTFE Tape
Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super..
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1700 Heat Bondable PTFE Film
Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super..
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM D-882
Saint-Gobain Norton® Fluorglas® Chemfilm® DF1900 Heat Bondable PTFE Film
Description: Chemfilm® Fluoropolymer Cast Films and Tapes for Wire and Cable Industry: Multi-layer cast film process ensures inherently pin-hole free structure, therefore cast films possess super..
Tensile Modulus 0.414 GPa
60.0 ksi
1 mm/min
Arkema Group Pebax® 7033 SN 01 Polyether Block Amide (PEBA) (Dry)
POLYETHER BLOCK AMIDE (PEBA) hardness 70 shore D Non plasticized flexible Polyamide Outstanding mechanical properties at low temperature (-40°C) Applications: Sport (Football shoe sole, ski top lay..
Tensile Modulus 0.414 GPa
60.0 ksi
ASTM C297
Touchstone CFOAM® 20 Structural Carbon Foam
CFOAM, developed by Touchstone Research Laboratory, Ltd., is a next generation structural material which is inexpensive, lightweight, fire-resistant, impact-absorbing, and which can be thermally ins..
Tensile Modulus 0.414 - 0.483 GPa
60.0 - 70.0 ksi
TM R050-36
Resinlab® EP1305 Black Highly Toughened Urethane Modified Epoxy
Resinlab™ EP1305 Black is a highly toughened urethane modified epoxy designed for bonding PVC, metals, ceramics and other difficult to bond substrates. The system has a thixotropic non-sag viscosi..
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