Polymer Property : Tensile Modulus = 0.138 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.138 GPa	20.0 ksi
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
Tensile Modulus	0.138 GPa	20.0 ksi	TM R050-36
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
Tensile Modulus	0.138 GPa	20.0 ksi	Mixed 1:2; TM R050-36
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Tensile Modulus	0.138 GPa	20.0 ksi	TM R050-36
Resinlab® EP1225 Black Unfilled Epoxy Adhesive Resinlab™ EP1225 Black is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. It has slightly thixotropic viscosity to give gap filling ability bust stil..
Tensile Modulus	0.138 GPa	20.0 ksi	ASTM D1709
Westlake EC474AA Low Density Polyethylene WESTLAKE low-density polyethylene EC474 is a general-purpose formulation used for extrusion coating and laminating. It can be drawn down to low coating weights, is processable at high speeds, has go..
Tensile Modulus	0.138 GPa	20.0 ksi	ASTM D1709
Westlake EC479AA Low Density Polyethylene WESTLAKE low-density polyethylene EC479 is recommended for use in the boardstock coating industry. This resin has low neck-in, good heat sealing properties, and good drawdown characteristics.Applica..
Tensile Modulus	0.138 GPa	20.0 ksi
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..