Polymer Property : Compressive Modulus = 1.38 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Fluorosint® 135 PTFE and PPS Blend, with Proprietary Lubrication Fillers (ASTM Product Data Sheet) Chemical resistance parallels PTFE Continuous use temperatures to 500°F (260°C) Compared to PTFE higher load carrying capability 1/9 of the deformation under load lower coefficient of thermal exp..
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Proteus® O & P Grade, Natural Homopolymer Polypropylene (ASTM Product Data Sheet)
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Proteus® PP, Black Homopolymer Polypropylene (ASTM Product Data Sheet) High impact resistance strength Better resistance to cracking at low temperatures than Homopolymer Polypropylene More pliable than homopolymer Meets food handling guidelines Chemical- and corrosion..
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Proteus® PP, Natural Homopolymer Polypropylene (ASTM Product Data Sheet)
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Proteus® PP, ProKnob Finish Natural Homopolymer Polypropylene (ASTM Product Data Sheet) High impact resistance strength Better resistance to cracking at low temperatures than Homopolymer Polypropylene More pliable than homopolymer Meets food handling guidelines Chemical- and corrosion..
Compressive Modulus	1.38 GPa	200 ksi	Average value: 1.38 GPa Grade Count:6
Overview of materials for Polypropylene, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene, Molded". Each property range of values reported is minimum and maximum values of appropri..
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Westlake Plastics Absylux® FR Acrylonitrile-Butadiene-Styrene Flame Retardant Absylux ABS is a low cost engineering plastic that is easy to machine and fabricate. It is an ideal material for structural applications when impact resistance, strength, and stiffness are required..
Compressive Modulus	1.38 GPa	200 ksi	Stabilized, typ
Hexcel® HexWeb® CR III 3/8-5052-.004 Corrosion Resistant Specification Grade Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge."5052 and 5056 expanded aerospace grade aluminum honeycomb materials are available in a wide selection of cell sizes and foil gauges. The HexWeb CR..
Compressive Modulus	1.38 GPa	200 ksi	Stabilized, typ
Hexcel® HexWeb® CR-PAA™ 3/8-5052-0.004 Phosphoric Acid Anodized Aluminum Honeycomb Grade is designated as "Cell Size-Alloy-Foil Gauge." The life cycle of aluminum honeycomb sandwich structures in a given application can be directly related to the quality of the bond between the fa..
Compressive Modulus	1.38 - 2.07 GPa	200 - 300 ksi	ASTM D695
Cast Nylons Nycast® CP Caprolactam/Laurinlactum Copolymer Cast Nylon Highly resilient, with higher tensile elongation and impact strength than standard grades, NYCAST® CP is used applications requiring an extra degree of toughness. A copolymer of caprolactam and lau..
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Proteus® White Homopolymer Polypropylene (ASTM Product Data Sheet)
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1026HP Epoxy Adhesive Resinlab™ EP1026HP is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product gives good resistance to water salt spray, inorgan..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett..
Compressive Modulus	1.38 GPa	200 ksi	ASTM D695
Quadrant EPP Sanalite® PP, Homopolymer Polypropylene Cutting Board (FDA, USDA, & NSF) (ASTM Product Data Sheet)
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1026 Black Epoxy Adhesive Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in ..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1046FG Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Black is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to..
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Resinlab® EP1046FG Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Clear is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to..