Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | tensile shear; ASTM D1002 |
ITW Devcon Metal Repair Wear Resistant Epoxy (WR-2), Dark Grey Information provided by ITW Devcon |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Steel-Steel |
Master Bond MB300 Cyanoacrylate Adhesive System General purpose wicking grade, fills gap to 0.002Information provided by Master Bond Inc. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Bond 2113 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to gla.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear, alum to alum, @ 25°C |
Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear, alum to alum, 3 hrs @ 74°C |
Tra-Con Tra-Bond 724-5 Low Viscosity Polyurethane Adhesive TRA-BOND 724-5 is a premixed and frozen, electrically insulating, polyurethane adhesive. This resilient adhesive exhibits good adhesion to a wide variety of substrates, including aluminum, solder, n.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | |
Trelleborg Emerson & Cuming Eccobond® 286 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 286 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose, thermally conductive, epoxy adhesive. Room temperature cure. Convenient mix ratio. Recommended fo.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | |
Trelleborg Emerson & Cuming Eccobond® 51 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 51 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose epoxy adhesive. Used with a variety of catalysts. Excellent adhesion to a variety of metal, plastic.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 161-3 Temperature Resistant Epoxy Adhesive TRA-BOND 161-3 two component, premixed and frozen, epoxy adhesive is highly filled. This electrically insulating adhesive provides structural strength to 150°C and semi structural strength to 300°.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap shear, alum to alum, 1 hr @ 65°C |
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Varies with substrates |
Loctite® SpeedBonder™ 325 High Temperature Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. .. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | SSPC SP3-Wet; ASTM D1002 |
Chesterton ARC 5ES Rapid Repair Stick Description: ARC 5ES is specifically formulated for quick reliable repairs. Its “stick” design combines the performance of a two component system with the convenience of a single component. The AR.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap Shear Strength |
Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Lap Shear Strength |
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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Adhesive Bond Strength | 15.2 MPa @Temperature 25.0 °C |
2200 psi @Temperature 77.0 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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Adhesive Bond Strength | 15.2 MPa @Temperature 25.0 °C |
2200 psi @Temperature 77.0 °F |
Aluminum-Aluminum tensile shear |
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor.. |
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Adhesive Bond Strength | 15.2 MPa @Temperature -54.4 °C |
2200 psi @Temperature -66.0 °F |
Aluminum-Aluminum tensile shear |
Armstrong C-7/H20 Epoxy Adhesive A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | |
Atom Adhesives AA-BOND 2113 Epoxy Adhesive AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla.. |
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Adhesive Bond Strength | 15.2 MPa | 2200 psi | Al-to-Al Lap Shear; Cured property; ASTM D1002 |
Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d.. |