Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum, 4 hrs @ 65°C |
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at .. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum |
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum, 5 min @ 125°C |
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | |
Trelleborg Emerson & Cuming Eccobond® 26 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 26 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, room temperature curing, general purpose, epoxy adhesive. Recommended for varied uses including repair and manufact.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap Shear; ASTM D1002 |
Chesterton ARC 858 Abrasion resistant rebuilding and faring composite An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m.. |
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Adhesive Bond Strength | >= 14.5 MPa | >= 2100 psi | Lap Shear; ASTM D4541 |
Chesterton ARC S2 Ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% soli.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap Shear; ASTM D1002 |
Chesterton MRS S2 Metal Rebuilding System An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% solids. MRS S2 is.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap Shear Strength |
Epoxyset Epoxibond EB-315 Low Expansion Epoxy Adhesive EB-315 is a highly filled, heat curing, high temperature resistant epoxy adhesive. Due to its low coefficient of thermal expansion and outgassing, it can be used for bonding and sealing in critical .. |
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Adhesive Bond Strength | 14.5 MPa @Temperature 82.2 °C |
2100 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-10-T Epoxy Adhesive Clear, thixotropic, 5-minute cure general-purpose epoxy adhesive. Provides rapid high strength bonds to many substrates. Supplied in 1:1 ratio dispense kits for easy application.Information provid.. |
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Adhesive Bond Strength | 14.5 MPa @Temperature 82.2 °C |
2100 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-2/A Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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Adhesive Bond Strength | 14.5 MPa @Temperature 82.2 °C |
2100 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong C-7/H20 Epoxy Adhesive A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap shear, alum to alum |
Atom Adhesives AA-BOND FDA22 Epoxy Adhesive AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administ.. |
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Adhesive Bond Strength | 14.5 MPa @Temperature -54.4 °C |
2100 psi @Temperature -66.0 °F |
Aluminum-Aluminum tensile shear |
Armstrong A-3/E Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Lap Shear; ASTM D1002 |
Chesterton MRS 58 Metal Rebuilding System An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo.. |
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Adhesive Bond Strength | 14.5 MPa | 2100 psi | Grit blasted steel |
Loctite® PRISM® 4204 Instant Adhesive Cyanoacrylate Bonding AdhesivesLoctite® technology has made the productivity promises of cyanoacrylate adhesives a reality with the industry's widest selection of high-performance, application-.. |