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Polymer Property : Adhesive Bond Strength = 15.2 MPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Adhesive Bond Strength 15.2 MPa
2200 psi
tensile shear; ASTM D1002
ITW Devcon Metal Repair Wear Resistant Epoxy (WR-2), Dark Grey
Information provided by ITW Devcon
Adhesive Bond Strength 15.2 MPa
2200 psi
Steel-Steel
Master Bond MB300 Cyanoacrylate Adhesive System
General purpose wicking grade, fills gap to 0.002Information provided by Master Bond Inc.
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Bond 2113 Clear Low Viscosity Epoxy Adhesive
TRA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to gla..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear, alum to alum, @ 25°C
Tra-Con Tra-Bond 293-14 Electrically Conductive Silver-Filled Epoxy Adhesive
TRA-BOND 293-14 silver-filled, electrically conductive epoxy adhesive is designed to provide strong bonds to difficult-to-bond metals, such as nickel, copper, gold and solder. The stress-absorbing c..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear, alum to alum, 3 hrs @ 74°C
Tra-Con Tra-Bond 724-5 Low Viscosity Polyurethane Adhesive
TRA-BOND 724-5 is a premixed and frozen, electrically insulating, polyurethane adhesive. This resilient adhesive exhibits good adhesion to a wide variety of substrates, including aluminum, solder, n..
Adhesive Bond Strength 15.2 MPa
2200 psi
Trelleborg Emerson & Cuming Eccobond® 286 Two-Component General Purpose Epoxy Adhesive
Emerson & Cuming 286 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose, thermally conductive, epoxy adhesive. Room temperature cure. Convenient mix ratio. Recommended fo..
Adhesive Bond Strength 15.2 MPa
2200 psi
Trelleborg Emerson & Cuming Eccobond® 51 Two-Component General Purpose Epoxy Adhesive
Emerson & Cuming 51 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose epoxy adhesive. Used with a variety of catalysts. Excellent adhesion to a variety of metal, plastic..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear, alum to alum
Tra-Con Tra-Bond 161-3 Temperature Resistant Epoxy Adhesive
TRA-BOND 161-3 two component, premixed and frozen, epoxy adhesive is highly filled. This electrically insulating adhesive provides structural strength to 150°C and semi structural strength to 300°..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap shear, alum to alum, 1 hr @ 65°C
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive
TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Adhesive Bond Strength 15.2 MPa
2200 psi
Varies with substrates
Loctite® SpeedBonder™ 325 High Temperature Acrylic Bonding Adhesive
Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Adhesive Bond Strength 15.2 MPa
2200 psi
SSPC SP3-Wet; ASTM D1002
Chesterton ARC 5ES Rapid Repair Stick
Description: ARC 5ES is specifically formulated for quick reliable repairs. Its “stick” design combines the performance of a two component system with the convenience of a single component. The AR..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap Shear Strength
Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive
A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by..
Adhesive Bond Strength 15.2 MPa
2200 psi
Lap Shear Strength
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Adhesive Bond Strength 15.2 MPa

@Temperature 25.0 °C
2200 psi

@Temperature 77.0 °F
Aluminum-Aluminum tensile shear
Armstrong A-2/A Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
Adhesive Bond Strength 15.2 MPa

@Temperature 25.0 °C
2200 psi

@Temperature 77.0 °F
Aluminum-Aluminum tensile shear
Armstrong C-1/A Epoxy Adhesive
A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Adhesive Bond Strength 15.2 MPa

@Temperature -54.4 °C
2200 psi

@Temperature -66.0 °F
Aluminum-Aluminum tensile shear
Armstrong C-7/H20 Epoxy Adhesive
A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Adhesive Bond Strength 15.2 MPa
2200 psi
Atom Adhesives AA-BOND 2113 Epoxy Adhesive
AA-BOND 2113 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flow ability and wetting characteristics, and adheres strongly to gla..
Adhesive Bond Strength 15.2 MPa
2200 psi
Al-to-Al Lap Shear; Cured property; ASTM D1002
Aptek 6500-PMF Electrically conductive epoxy adhesive
High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d..
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