Polymer Property : Adhesive Bond Strength = 1300 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Adhesive Bond Strength	8.96 MPa	1300 psi	ABS-ABS
Master Bond MB297 Cyanoacrylate Adhesive System General purpose, fills gap to 0.008Information provided by Master Bond Inc.
Adhesive Bond Strength	8.96 MPa	1300 psi	ABS-ABS
Master Bond MB300 Cyanoacrylate Adhesive System General purpose wicking grade, fills gap to 0.002Information provided by Master Bond Inc.
Adhesive Bond Strength	8.96 MPa	1300 psi	ABS-ABS
Master Bond MB302 Cyanoacrylate Adhesive System For rubber & plastic bonding, fills gap to 0.005Information provided by Master Bond Inc.
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap shear, alum to alum, 4 hrs @ 65°C
Tra-Con Tra-Bond 2159 Heat Conductive Electrically Insulating Compound TRA-BOND 2159 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap shear, alum to alum, 10 min @ 100°C
Tra-Con Tra-Duct 2907 Silver-Filled Epoxy Adhesive TRA-DUCT 2907 is an electrically conducting silver-filled medium viscosity epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical an..
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap Shear Strength
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc.
Adhesive Bond Strength	8.96 MPa	1300 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Adhesive Bond Strength	8.96 - 15.9 MPa	1300 - 2310 psi	Average value: 11.7 MPa Grade Count:3
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..