Polymer Property : Adhesive Bond Strength = 11.0 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; Mixed 2:1; TM R050-37
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Adhesive Bond Strength	11.0 MPa	1600 psi	lap shear (bond line thickness of 0.005"); ASTM D1002
ITW Devcon One minuteâ„¢ Epoxy Gel, Amber Information provided by ITW Devcon
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 1 hr @ 150°C
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 2 hrs @ 65°C
Tra-Con Tra-Bond 862-13 Information provided by Tra-Con Inc.
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 24 hrs @ 25°C
Tra-Con Tra-Bond FS469 Clear High Strength Epoxy TRA-BOND FS469 is a clear low viscosity epoxy formulation designed for bonding and coating micro-electronics, laminations, optical components and laser assemblies. The low cure shrinkage (using a ro..
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 15 min @ 100°C
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..
Adhesive Bond Strength	11.0 MPa	1590 psi	Lap shear, alum to alum, 1 hr @ 65°C
Tra-Con Tra-Duct 916H02 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H02 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 1 hr @ 110°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Adhesive Bond Strength	11.0 MPa	1600 psi	Lap shear, alum to alum, 15 min @ 150°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Adhesive Bond Strength	11.0 MPa @Temperature 25.0 °C	1600 psi @Temperature 77.0 °F	Aluminum-Aluminum tensile shear
Armstrong A-4/A Epoxy Adhesive Is a heavy, non-metallic filled, gray paste epoxy that provides excellent thixotropic non-sag bond lines. It can be used for small volume casting applications.Information provided by Ellsworth Adhe..
Adhesive Bond Strength	11.0 MPa @Temperature 25.0 °C	1600 psi @Temperature 77.0 °F	Aluminum-Aluminum tensile shear
Armstrong C-1/E Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Adhesive Bond Strength	11.0 MPa @Temperature 82.2 °C	1600 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Adhesive Bond Strength	11.0 MPa @Temperature 25.0 °C	1600 psi @Temperature 77.0 °F	Aluminum-Aluminum tensile shear
Armstrong X-81-A/F Epoxy Adhesive Information provided by Ellsworth Adhesives.