Polymer Property : Modulus of Elasticity = 2600 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	17.9 GPa	2600 ksi	X; ASTM D3039
Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Modulus of Elasticity	17.9 GPa	2600 ksi
Indium Corp. IndalloyÂ® 246 95.5Sn/4.0Ag/0.5Cu Lead-Free Solder Alloy Petzow (German) prior art reference makes this alloy patent-free.Information provided by the manufacturer, Indium Corporation.
Modulus of Elasticity	17.9 GPa	2600 ksi
SGL Carbon Group EK 2243 Carbon Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and..
Modulus of Elasticity	17.9 GPa	2600 ksi
SGL Carbon Group EK 24 Carbon Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and..
Modulus of Elasticity	17.9 GPa	2600 ksi	IPC TM-650 2.4.18.3
Arlon 49N Multifunctional Epoxy Low-Flow Prepreg 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. With a high Tg, the prepreg can be used in high-performance or high-te..
Modulus of Elasticity	17.9 GPa	2600 ksi	IPC TM-650 2.4.18.3
Arlon 51N Lead-Free Compatible Epoxy Low-Flow 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stabili..
Modulus of Elasticity	17.9 GPa	2600 ksi	IPC TM-650 2.4.18.3
Arlon 47N Quick Cure Epoxy Low-Flow Prepreg 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mou..