Polymer Property : Storage Temperature = 0.000 °F Product List

Physical Properties

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Physical Properties	Metric	English
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 382H (0.06 psf) Film Adhesive Redux 382H is a 250°F curing modified epoxy film adhesive available in both supported and unsupported versions. Redux 382H is a versatile adhesive system suitable for bonding a wide variety of subs..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 382HU Film Adhesive Redux 382H is a 250°F curing modified epoxy film adhesive available in both supported and unsupported versions. Redux 382H is a versatile adhesive system suitable for bonding a wide variety of subs..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 609 (0.04 psf) Adhesive film for bonding metallic and composite components Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 ..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 609 (0.06 psf) Adhesive film for bonding metallic and composite components Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 ..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 382H (0.03 psf) Film Adhesive Redux 382H is a 250°F curing modified epoxy film adhesive available in both supported and unsupported versions. Redux 382H is a versatile adhesive system suitable for bonding a wide variety of subs..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 610U Flame retarded epoxy film adhesive Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are re..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 610W (0.03 psf) Flame retarded epoxy film adhesive Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are re..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 610W (0.06 psf) Flame retarded epoxy film adhesive Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are re..
Storage Temperature	-17.8 °C	0.000 °F
Hexcel® Redux® 610W (0.09 psf) Flame retarded epoxy film adhesive Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are re..