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Polymer Property : Storage Temperature = -18.0 °C Product List

Physical Properties

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Physical Properties Metric English Comments
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9628H Film Adhesive
First generation, modified epoxy film, high peel strength, good stress, environmental resistance and structural propertiesApplications: Composite Bonding, Metal & Honeycomb BondingData from .060 psf..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9658 Film Adhesive
High temperature and high durability film adhesive designed for high toughness and high temperature performanceApplications: Composite Bonding Metal and Honeycomb Bonding
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9673 (BMI) Film Adhesive
Modified BMI film adhesive, superior strength to 550°F / 288°C. Moisture resistant, processes like conventional high temperature epoxies. Minimum order required. Data from 0.10 psf, 500 g / m2..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9681 Film Adhesive
Epoxy film adhesive for bonding applications. Hysol EA9681 is formulated to provide excellent performance properties for many bonding applications, and has excellent results on composite surfaces th..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9695 Film Adhesive
Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9696 Film Adhesive
Second generation, moisture-resistant, toughened 250°F / 121°C service, modified epoxy film. Qualified to BMS 5-101 and BMS 5-129. Data from .060 psf, 300 g / m2.Applications: Composite Bondin..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9833.1 (BMI) Core Splice Adhesive
Modified BMI foaming core splice, co-curable with a wide variety of 350°F / 177°C curing epoxy prepregs. Elevated service temperature to 450°F / 232°C.
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9896 WPP Peel Ply
Pre-impregnated, nylon peel ply product supplied in film form. Specially designed resin system capable of curing at 250°F / 121°C. Compatible with state-of-the-art composite prepreg resin syst..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 696 Film Adhesive
Epoxy-based structural film adhesive designed primarily for out-of-autoclave curing process applications requiring low cure temperatures as well as low curing pressures and is also available in ligh..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 737 Film Adhesive
Nonmetallic, modified epoxy film specifically designed for use in structural aircraft components. Low flow characteristics.Application: Metal and Honeycomb Bonding
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynSpand 9840 Expanding Syntactic Film
Expanding modified epoxy film, cures at 300°F / 149°C, used for jet engine abradable fan seals.
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynSpand EA 9890 Expanding Syntactic Film
Expanding modified epoxy film, cures at 250°F / 121°C, used for jet engine abradable fan seals.
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol MA 557 Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 780-1 Film Adhesive
Nonmetallic, toughened, modified epoxy film designed for bonding metal, composite and thermoplastic structures. High shear properties at 350°F / 177°C. Excellent hot-wet properties. High flow ..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 795-1 Film Adhesive
Tougher version of Hysol PL 795. Excellent flow characteristics. Excellent tack and handling characteristics. Improved elevated temperature performance. Can be used for both surfacing film and light..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 795SF Composite Surfacing Film
Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. ..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9628 Film Adhesive
First generation, modified epoxy film, good stress, environmental resistance and structural propertiesApplications: Composite Bonding, Metal & Honeycomb BondingData from .060 psf, 300 g/m2
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9657 Film Adhesive
High temperature, service film adhesive designed for high honeycomb peel in a reticulated sound suppression structure. Qualified to BMS 5-137. Data from .080 psf, 400 g / m2.Applications: Composite ..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9686 Film Adhesive
Second generation, moisture resistant, toughened 250°F / 121°C curing film with service performance to 300°F / 149°C. Excellent for composite or metal bonding. Data from .060 psf, 300 g / m2.App..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9689 Film Adhesive
Modified epoxy film adhesive with high temperature strength and long-term thermal durability. Data from 0.10 psf, 500 g/m2.Applications: Composite Bonding Metal and Honeycomb Bonding
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9845 SF Composite Surfacing Film
Epoxy-based composite surfacing film improves surface quality of honeycomb stiffened composite parts. Reduced weight vs conventional surfacing films. Cures at 250°F/121°C or 350°F/177°C with a v..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol MA 560 Core Splice Adhesive
A modified epoxy, low density (24-25 psf) foaming film adhesive capable of expanding 2.5 times the original thickness. Cures at 250°F / 121°C or 350°F / 177°C and is designed for service at temp..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol PL 795 Film Adhesive
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi..
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynCore 9823.1 Syntactic Film
Toughened, low density syntactic core, superior moisture resistance, co-curable with a variety of 250°F / 121°C curing epoxy prepregs.
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynSpand 9899 Expanding Syntactic Film
Very high expansion, closed cell expanding film designed for use as shop floor aid in closed mold processes.
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9820 Paste Adhesive System
High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a..
Storage Temperature -18.0 °C
-0.400 °F
Henkel Hysol EA 9825 Paste Adhesive System
Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an..
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynCore 9872.1 Syntactic Film
Toughened, low density syntactic core, superior moisture resistance, co-curable with a wide variety of 350°F / 177°C curing epoxy prepregs.
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynCore HC 9875 Syntactic Film
High crush strength, low density syntactic core material, co-curable with a variety of 350°F / 177°C curing epoxy prepregs.
Storage Temperature -18.0 °C
-0.400 °F
Henkel SynSpand 9835 Expanding Syntactic Film
Expanding modified epoxy film, cures at 300°F / 149°C, used for jet engine abradable fan seals.
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