Polymer Property : Thickness = 0.709 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	18.0 - 50.0 microns	0.709 - 1.97 mil	Recommended
Polimeri Europa Riblene® FM 23 Low Density Polyethylene - Blown Film Extrusion Riblene FM 23 is a low density polyethylene (LDPE) with added slip and antiblocking agents, suitable for blown film extrusion. Riblene FM 23 is characterized by a good balance between processabilit..
Thickness	18.0 - 50.0 microns	0.709 - 1.97 mil	Recommended
Polimeri Europa Riblene® FM 34 Low Density Polyethylene - Blown Film Extrusion Riblene FM 34 is a low density polyethylene (LDPE) with added slip and antiblocking agents, suitable for blown film extrusion. Riblene FM 34 is characterized by a good balance between processabilit..
Thickness	18.0 - 50.0 microns	0.709 - 1.97 mil	Recommended
Polimeri Europa Riblene® FM 50 Low Density Polyethylene - Blown Film Extrusion Riblene FM 50 is a low density polyethylene (LDPE) suitable for blown film extrusion. Riblene FM 50 is characterized by optimum optical properties and rigidity.Films manufactured with Riblene FM 50..
Thickness	18.0 - 50.0 microns	0.709 - 1.97 mil	Recommended
Polimeri Europa Riblene® FM 53 Low Density Polyethylene - Blown Film Extrusion Riblene FM 53 is a low density polyethylene (LDPE) with added slip and antiblocking agents, suitable for blown film extrusion. Riblene FM 53 is characterized by optimum optical properties and rigid..
Thickness	18.0 - 50.0 microns	0.709 - 1.97 mil	Recommended
Polimeri Europa Riblene® FM 34 E Low Density Polyethylene - Blown Film Extrusion Riblene FM 34 E is a low density polyethylene (LDPE) with added slip (erucamide) and antiblocking agents, suitable for blown film extrusion. Riblene FM 34 E is characterized by a good balance betwe..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD11 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSD11 is a general, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent flatness and machinability, and good heat seal strength and dim..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD12 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSD12 is a printing, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has corona trea..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD13 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSD13 is a metalizing, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One side has co..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSS11 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSS11 is a general, normal grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent flatness and machinability, and good heat seal strength and dimens..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSS12 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSS12 is a printing, normal grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has corona treatme..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead HSS13 Normal Grade Heat Sealable Film (thickness: 18 Âµm) HSS13 is a metalizing, normal grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One side has coron..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSD11 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSD11 is a general, low temperature grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent flatness, and good heat seal strength. One side has co..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSD12 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSD12 is a printing, low temperature grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has co..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSD13 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSD13 is a metalizing, low temperature grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One si..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSS11 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSS11 is a general, low temperature grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent flatness, and good heat seal strength. One side has coron..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSS12 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSS12 is a printing, low temperature grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has coron..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead LSS13 Low Temperature Grade Heat Sealable Film (thickness: 18 Âµm) LSS13 is a metalizing, low temperature grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One side ..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead ML11 General Grade BOPP Matt Film (thickness: 18 Âµm) ML11 is a general grade BOPP Matt film. It is translucent and non heat sealable. It has low static and a good matt surface. One side has corona treatment. It is specially designed for board laminati..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead ML21 General Grade BOPP Matt Film (thickness: 18 Âµm) ML21 is a general grade BOPP Matt film. It is translucent and non heat sealable. It has low static and a good matt surface. Both sides have corona treatment. It is specially designed for board lamin..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead PL11 Lamination Grade BOPP Plain Film (thickness: 18 Âµm) PL11 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. One side has corona treatment. It is widely used in laminating..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead PL13 Lamination Grade BOPP Plain Film (thickness: 18 Âµm) PL13 is a woven bag lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. One side has corona treatment. It is widely used in laminatin..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead PL21 Lamination Grade BOPP Plain Film (thickness: 18 Âµm) PL21 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. It has excellent dimensional stability, high tensile strength,..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead PM11 Metalizing Grade BOPP Plain Film (thickness: 18 Âµm) PM11 is a general, metalizing grade BOPP plain film. It is transparent and non heat sealable. It has good heat resistance and tensile strength, and it has excellent metal adhesion. One side has coro..
Thickness	18.0 microns	0.709 mil	Â± 3.0%; ASTM-252-78
Kinlead PP11 Printing Grade BOPP Plain Film (thickness: 18 Âµm) PP11 is a general, printing grade BOPP plain film. It is transparent and non heat sealable. It has excellent ink adhesion. One side has corona treatment. It is widely used in printing applications.I..
Thickness	18.0 - 25.0 microns	0.709 - 0.984 mil
Gwent Electronic Materials C2050503D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Thickness	18.0 microns	0.709 mil	Cured, Typical, Using a 230 mesh stainless steel screen, 13 micron emulsion
Gwent Electronic Materials C2051014P10 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. Applications in medical diagnostics, environmentalScreen Printing Equipment: semi-automatic, manualScreen Types: polye..
Thickness	18.0 microns	0.709 mil	Cured, Typical, Using a 230 mesh stainless steel screen, 13 micron emulsion
Gwent Electronic Materials C2080110D2 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. This is has been designed for fine line printing.Screen Printing Equipment: semi-automatic, manualScreen Types: polye..
Thickness	18.0 microns	0.709 mil	Critical Film Thickness; AGFP Method
Asahi Glass Fluon® XAD938 PTFE Aqueous Dispersion Fluon®PTFE aqueous dispersions are useful for glass cloth coating, metal coating, binder, additive in resin, feedstock of heat resistive paint ,etc.Information provided by Asahi Glass Company, Inc...
Thickness	18.0 microns	0.709 mil	Critical Film Thickness; AGFP Method
Asahi Glass Fluon® AD936 PTFE Aqueous Dispersion Fluon®PTFE aqueous dispersions are useful for glass cloth coating, metal coating, binder, additive in resin, feedstock of heat resistive paint ,etc.Information provided by Asahi Glass Company, Inc...