Polymer Property : Thickness = 0.200 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	<= 5.08 microns	<= 0.200 mil
Parker Chomerics CHO-BOND 1086 Conductive Caulk/Sealant Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particl..
Thickness	<= 5.08 microns	<= 0.200 mil
Parker Chomerics CHO-BOND 1085 Conductive Adhesive CHO-BOND® adhesives are electrically conductive epoxy and silicone resins. Curing mechanisms are either room temperature, elevated temperature or moisture. Both single and two-component systems are..
Thickness	5.08 - 76.2 microns	0.200 - 3.00 mil	<1Â±0.03 :: 1-1.5Â±0.05 :: >1.5Â±0.8
Sinotek Materials D Graphite Sheet Flexible Graphite Sheet/Roll is made from expanding Expandable Graphite under high temperature and then rolling. It has the characteristics of high temperature resistance, corrosion resistance and g..
Thickness	5.08 microns	0.200 mil	ASTM D3652
3M Scotch® 2693 High Performance Masking Tape Scotch® High Performance Masking Tape 2693 is a smooth, heavy duty, mini-crepe paper masking tape suitable for most paint masking applications. Designed for automotive, truck and bus applications w..
Thickness	5.08 microns	0.200 mil	Recommended
Parker Chomerics CHO-SHIELD® 1085 Silicone Adhesive Primer Air-drying liquid coatings used to improve the adhesion of Chomerics CHO-BOND conductive silicone elastomers to metal and other non-silicone substrates. The primers are moisture reactive and clear i..