Physical Properties | Metric | English | Comments |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
Raschig Group 2557 AMC Polyester Glass fiber reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, exceptional processability with short cycle time and low .. |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
Raschig Group 2567 AMC Glass fiber-reinforced and inorganically filled polyester molding compound (UP) in various colors. Outstanding mechanical strength similar to BMC/SMC, very good electrical isolation properties and .. |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
Raschig Group 6501 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | ISO 60 |
Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
Raschig Group AMPLA® 7250 melamine-modified polyester Cellulose reinforced melamine-modified Polyester molding compound. Very good electrical values, excellent heat resistance, excellent surface quality, low post shrinkage. This product meets the allow.. |
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Apparent Bulk Density | 0.700 - 0.900 g/cc | 0.0253 - 0.0325 lb/in³ | ISO 60 |
Raschig Group DECAL® 572R Phenolic Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati.. |
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Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on .. |
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Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
Raschig Group EPOXIDUR® 3582 EP Epoxy Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Moldi.. |
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Apparent Bulk Density | 0.700 - 1.00 g/cc | 0.0253 - 0.0361 lb/in³ | ISO 60 |
Raschig Group EPOXIDUR® 3585 EP Epoxy, Molded, Glass Fiber Filler Glass-fiber reinforced and inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excel.. |
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Apparent Bulk Density | 0.700 - 0.800 g/cc | 0.0253 - 0.0289 lb/in³ | ISO 60 |
Raschig Group SURAPLAST 54 UPA Glass fiber reinforced polyester molding compound. Minimal mold shrinkage and post-shrinkage, very good arc resistance, very good mechanical strength. This product meets the allowed upper limits for.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895B |
Solvay Specialty Polymers Ixef® BXT-2000/0203 Polyarylamide (PARA)
(Unverified Data**) Ixef BXT-2000/0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, Ixef BXT-2000/0203 resin can be successfully extruded into.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Apparent density per ASTM D1895 |
Plenco 4759 Phenolic, Granular, Injection Molded
(discontinued **) Two-stage Phenolic. PLENCO 04759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and possesses good electrical properties. It is used in appli.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
Plenco Valite 759 Novolac Phenolic, Granular, Injection Molded
(discontinued **) This Valite product has been replaced by Plenco 4759. Data provided by Plenco.VALITE 759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and p.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Tap density |
Momentive Performance Materials AC-6028 Boron Nitride (BN) Powder Grade AC-6028 consists of agglomerated particles of hexagonal Boron Nitride (BN) with a mean particle size between 100 and 150µ. It exhibits the unique properties of BN in a form readily used in.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D-1875 |
Lubrizol Advanced Materials Pearlthane® MB-9005 Thermoplastic Polyurethane Elastomer Pearlthane® MB-9005 is a TPU-based color masterbatch, supplied in the form of homogenously black colored pellets. It is specially intended for coloring TPUs (either polyester or polyether-based).. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | |
Cosmic Plastics K31 Short Glass Fiber Filled Iso Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
Tipco Tipcolite® TG 211 Phenolic Compound, Mineral & Wood Flour, Soft Flow & High Electrical Properties Soft Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
Tipco Tipcolite® TG 618 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | TRM-37 |
Tipco Tipcolite® THD 121 Phenolic Compound, Wood Flour, having Medium Flow & High Strength Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd.,
India... |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Tap density |
Carborundum CarboTherm™ CTH30 Boron Nitride Powder Boron Nitride powders have high thermal conductivity, low dielectric loss, and low thermal expansion. They are non-abrading to electronic components, lubricious, non-toxic, and retain their dielect.. |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
Amity Thermosets ATE 183 M Phenolic Molding Mica and organic Filler, Compression Molded Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl.. |
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Apparent Bulk Density | 0.700 - 0.800 g/cc | 0.0253 - 0.0289 lb/in³ | IS 867-1963 |
Amity Thermosets ATS 135 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded Characteristics: Self lubricating Good mechanical strength Low co-efficient of friction Good thermal conductivity Heat stable (200°C) Good mouldability Not suitable for electrical application Color.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
Ashley Polymers Ashlene® 531 Nylon 66 For Monofilament spinning/super dry.Data provided by the manufacturer |
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Apparent Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | IS 867-1963 |
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl.. |
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Apparent Bulk Density | 0.700 - 0.750 g/cc | 0.0253 - 0.0271 lb/in³ | IS 867-1963 |
Amity Thermosets ATS 1613-G Phenolic Molding Nylon and inorganic Filler, Compression Molded Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 |
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ASTM D1895 |
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock.. |