Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Apparent Bulk Density = 0.0253 lb/in³ Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Physical Properties Metric English Comments
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ASTM D1895
Nilit Polynil® P-240 General Purpose Nylon 66
High Viscosity. Moisture content
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
ISO 60
Raschig Group 2557 AMC Polyester
Glass fiber reinforced polyester molding compound. Very good mechanical strength, very good electrical properties and dimensional stability, exceptional processability with short cycle time and low ..
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
ISO 60
Raschig Group 2567 AMC
Glass fiber-reinforced and inorganically filled polyester molding compound (UP) in various colors. Outstanding mechanical strength similar to BMC/SMC, very good electrical isolation properties and ..
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
ISO 60
Raschig Group 6501 DAIP
Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
ISO 60
Raschig Group 6502 DAIP Diallyl Phthalate (DAP), Cast, Mineral Filler
Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi..
Apparent Bulk Density 0.700 - 0.900 g/cc
0.0253 - 0.0325 lb/in³
ISO 60
Raschig Group AMPLA® 2500 melamine-modified polyester
Halogen-free, organically and inorganically filled melamine-modified Polyester molding compound. Excellent elasticity and shock resistance, low post-shrinkage, very good electrical values, high heat..
Apparent Bulk Density 0.700 - 0.900 g/cc
0.0253 - 0.0325 lb/in³
ISO 60
Raschig Group AMPLA® 7500 melamine-modified polyester
Organically and inorganically filled melamine modified Polyester molding compound. Low post-shrinkage, very good electrical values, excellent heat resistance, very good sliding behavior and wear sta..
Apparent Bulk Density 0.700 - 0.900 g/cc
0.0253 - 0.0325 lb/in³
ISO 60
Raschig Group DECAL® 572R Phenolic
Glass-fiber reinforced phenolic molding compound. Exceptional heat resistance with regard to maintaining surface finish and mechanical properties, outstanding mechanical properties, excellent rotati..
Apparent Bulk Density 0.700 - 0.900 g/cc
0.0253 - 0.0325 lb/in³
ISO 60
Raschig Group DECAL® 937 Phenolic
Mica reinforced phenolic molding compound. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (W..
Apparent Bulk Density 0.700 - 1.00 g/cc
0.0253 - 0.0361 lb/in³
ISO 60
Raschig Group EPOXIDUR® 3581 S ZC EP Epoxy Molding Compound
Inorganically filled epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. Very good sealing connection on ..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ASTM D1895B
Solvay Specialty Polymers Ixef® BXT-2000/0203 Polyarylamide (PARA)  (Unverified Data**)
Ixef BXT-2000/0203 resin was developed specifically for extrusion and blow-molding processes. Unlike grades targeted for injection molding, Ixef BXT-2000/0203 resin can be successfully extruded into..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ISO 60
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
Apparent density per ASTM D1895
Plenco 4759 Phenolic, Granular, Injection Molded  (discontinued **)
Two-stage Phenolic. PLENCO 04759 is a black, two stage, medium heat resistant phenolic molding compound. It has excellent molded finish and possesses good electrical properties. It is used in appli..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ASTM D1895
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ASTM D1895
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound  (discontinued **)
Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
Tap density
Momentive Performance Materials AC-6028 Boron Nitride (BN) Powder
Grade AC-6028 consists of agglomerated particles of hexagonal Boron Nitride (BN) with a mean particle size between 100 and 150µ. It exhibits the unique properties of BN in a form readily used in..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
Apparent packing density; ISO 1068
SolVin 266SC Polyvinyl Chloride Pastes - filler Polymers
Made by suspension polymerization. APPLICATIONS Filler polymer for plastisols. CHARACTERISTICS SolVin 266SC is a suspension resin with very low porosity, small particle size and a very low amount of..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
TRM-37
Tipco Tipcolite® TG 211 Phenolic Compound, Mineral & Wood Flour, Soft Flow & High Electrical Properties
Soft Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
TRM-37
Tipco Tipcolite® TG 311 Phenolic Compound, Mineral & Wood Flour, Medium Flow & High Electrical Properties
Medium Flow Phenolic Compound, Reinforced with Mineral & Wood FlourApplications: Electrical & ElectronicsProcessing: Compression & TransferInformation provided by the Manufacturer, Tipco Industrie..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
TRM-37
Tipco Tipcolite® THD 121 Phenolic Compound, Wood Flour, having Medium Flow & High Strength
Medium Flow Phenolic Compound, Reinforced with Wood FlourApplications: Electrical & ElectronicsProcessing: Compression MoldingInformation provided by the Manufacturer, Tipco Industries Ltd., India...
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
TRM-37
Tipco Tipcolite® VASW 150 Phenolic Compound, Glass Fibers & Minerals, Medium-Soft Flow & High Strength
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
IS 867-1963
Amity Thermosets ATE 183 M Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
Apparent Bulk Density 0.700 - 0.800 g/cc
0.0253 - 0.0289 lb/in³
IS 867-1963
Amity Thermosets ATS 135 Phenolic Molding Inorganic and glass fiber Filler, Compression Molded
Characteristics: Self lubricating Good mechanical strength Low co-efficient of friction Good thermal conductivity Heat stable (200°C) Good mouldability Not suitable for electrical application Color..
Apparent Bulk Density 0.700 - 0.750 g/cc
0.0253 - 0.0271 lb/in³
IS 867-1963
Amity Thermosets ATS 1612 Phenolic Molding Nylon, inorganic, and glass Filler, Compression Molded
Characteristics:High dielectric & mechanical strengthWeather resistant Good electric insulationLow water absorption Good mechanical tension bearing capacityColor-blackSoft/Medium flow Applications:R..
Apparent Bulk Density 0.700 - 0.850 g/cc
0.0253 - 0.0307 lb/in³
IS 867-1963
Amity Thermosets ATE 183 Phenolic Molding Mica and organic Filler, Compression Molded
Characteristics:Electric low loss Low water absorption Low shrinkage Heat stableGlossy surface finishVery good mouldabilityGood electrical insulationGood chemical resistantColor-blackMedium flowAppl..
Apparent Bulk Density 0.700 - 0.950 g/cc
0.0253 - 0.0343 lb/in³
ISO 60
Raschig Group RALUPOL® 8605 UP Polyester
Glass fiber reinforced polyester molding compound. Resistant to hydrolysis. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU dire..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ISO 60
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Apparent Bulk Density 0.700 - 1.30 g/cc
0.0253 - 0.0470 lb/in³
Average value: 0.950 g/cc Grade Count:5
Overview of materials for Epoxy Molding Compound
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ISO 60
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti
Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Apparent Bulk Density 0.700 g/cc
0.0253 lb/in³
ASTM D1895
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..
Copyright © lookpolymers.com All Rights Reserved