Physical Properties | Metric | English | Comments |
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Viscosity | 8000 cP @Temperature 190 °C |
8000 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 3180 Amorphous Polyalphaolefin (APAO) Modified Bitumen Roofing Grade.Description: Propylene homopolymer and FDA compliantFeatures: Temperature resistance, high melt viscosity, and increased hardnessApplications: Component of modified bi.. |
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Viscosity | 8000 cP @Temperature 190 °C |
8000 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 3280 Amorphous Polyalphaolefin (APAO) Modified Bitumen Roofing Grade.Description: Ethylene copolymer and FDA compliantFeatures: Temperature resistance, high melt viscosity, and hardnessApplications: Component of modified bitumen roofing.. |
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Viscosity | 8000 cP | 8000 cP | Part A |
TSE Industries EcoSPRAY® 350c Flame-Retardant Polyurethane Resin TSE-EcoSPRAY® 350c is an “Environmentally-Preferred Product” or EPP. It is a Thixotropic flame retardant polyurethane resin free of Styrene, and is an “ultra-low” emitting resin during applica.. |
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Viscosity | 8000 - 20000 cP | 8000 - 20000 cP | |
Huntsman Araldite XU 3903 Water-Based Adhesive/Coating Base Resin is GT 7013 (Type 3). Mean Particle Size |
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Viscosity | 8000 - 11000 cP | 8000 - 11000 cP | |
Huntsman XU MY 722 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 117 to 134. Color: BrownComments/Applications: New chemistry; lowest viscosity tetra-functional epoxy resin overall. Room temperature stable. Used for composites, a.. |
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Viscosity | 8000 cP | 8000 cP | Mixed Viscosity |
ITW Devcon 2 Ton® Epoxy Clear Epoxy, Clear, White Information provided by ITW Devcon |
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Viscosity | 8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 25.0 °C |
8000 - 10000 cP @Shear Rate 50.0 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2070920D1 Depolymerisable Carbon Ink This product is designed as a screen printable ink. This product is based on a thermoplastic resin system designed to burn out completely during firing to leave a void of specific shape and dimensi.. |
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Viscosity | 8000 - 10500 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
8000 - 10500 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2090819P2 Silver Ink This product is part of a range of Heat Curable Inks designed specifically for use in Photovoltaic panels. These products are based on a unique curing process that results in the low temperature fo.. |
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Viscosity | 8000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
8000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7350-9000 TPE Product Description: StarFlex P 7350-9000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelGood WeatherabilityFDA and medical grades availableProcessing Metho.. |
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Viscosity | 8000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
8000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7370-9000 TPE Product Description: StarFlex P 7370-9000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelGood WeatherabilityFDA and medical grades availableProcessing Method.. |
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Viscosity | 8000 - 12000 cP | 8000 - 12000 cP | |
Solvay SIPOMER® PAM-300 Phosphate Esters of Ppg Monoacrylate Description: Sipomer PAM-200 incorporated into acrylic resin systems improves adhesion to metallic substrates and glass. Due to its versatile compatibility characteristics with various common solven.. |
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Viscosity | 8000 - 9000 cP | 8000 - 9000 cP | Mixed |
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil.. |
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Viscosity | 8000 - 10000 cP @Temperature 23.0 °C |
8000 - 10000 cP @Temperature 73.4 °F |
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Master Bond EP50-1.5 Fast Setting, Fast Curing Two Component Epoxy Adhesive Master Bond Polymer Adhesive EP50-1.5 is an exceptionally fast setting, fast curing two component epoxy. EP50-1.5, for general purpose bonding, is formulated to cure at room temperature with a one-t.. |
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Viscosity | 8000 - 10000 cP | 8000 - 10000 cP | Part B |
Master Bond EP65HT Fast Setting Epoxy Resists High Temperatures Description: Master Bond EP65HT represents a highly innovative advance in epoxy technology in that it features the unusual combination of very fast cures and high temperature resistance. While typic.. |
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Viscosity | 8000 - 12000 cP | 8000 - 12000 cP | Part B |
Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance.. |
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Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® 1071 PVC PVC Homopolymer Dispersion Resin F-1071 is a high molecular weight, fine particle size PVC homopolymer dispersion resin with low surfactant content. The high molecular weight results in product with.. |
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Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® KVF PVC PVC Homopolymer Dispersion Resin F-KVF is a medium molecular weight, fine particle PVC homopolymer dispersion which imparts pesudoplastic flow to plastisol in which it is used. Plastisol prepared ut.. |
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Viscosity | 8000 cP | 8000 cP | Mixed |
Tra-Con Tra-Bond 342-14T Low Viscosity Room Temperature Cure Epoxy Adhesive TRA-BOND 342-14T single component, low viscosity alumina-filled epoxy adhesive exhibits high bond strength and excellent thermal shock characteristics. This adhesive may be cured at room temperature.. |
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Viscosity | 8000 cP @Temperature 25.0 °C |
8000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 2072 Two-Component Easy Mix Ratio Encapsulant Features and Typical ApplicationsPrimarily designed for ease of use in either meter mix or manual dispense operations. These products also offer a wide range of features including heat dissipation, .. |
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Viscosity | 8000 cP | 8000 cP | Part A |
TSE Industries EcoSPRAY® 350c Flame-Retardant Polyurethane Resin TSE-EcoSPRAY® 350c is an “Environmentally-Preferred Product” or EPP. It is a Thixotropic flame retardant polyurethane resin free of Styrene, and is an “ultra-low” emitting resin during applica.. |
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Viscosity | 8000 - 10000 cP @Temperature 23.0 °C |
8000 - 10000 cP @Temperature 73.4 °F |
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Master Bond UV15TK High Temperature Resistant One Component UV Curable System Master Bond UV15TK is a moderate viscosity, epoxy based UV curable system for bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. It is also compl.. |
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Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® 10 PVC PVC Homopolymer Dispersion Resin F-10 is a medium molecular weight PVC homopolymer dispersion resin with low residual surfactant content. Plastisol prepared using F-10 exhibit low paste viscosity as.. |
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Viscosity | 8000 cP | 8000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® KVH PVC PVC Homopolymer Dispersion Resin F-KVH is a structured high molecular weight PVC homopolymer dispersion resin which imparts pseudoplastic flow in which it is used. Plastisol prepared utilizing F-KVH.. |
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Viscosity | 8000 cP | 8000 cP | dynamic |
Dow Corning 1430 ANTIFOAM Stable at high and low pH. Dow Corning® Antifoam 1430 is a water-dilutable, 30 percent active silicone emulsion that is designed to control foam in aqueous systems.Information provided by Dow Corni.. |
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Viscosity | 8000 cP | 8000 cP | A Component; ASTM D1824 |
Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space appl.. |
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Viscosity | 8000 cP | 8000 cP | Mixed; TM R050-12 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Viscosity | 8000 cP @Temperature 190 °C |
8000 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 2780 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Butene-1 copolymer and FDA compliantFeatures: Very low softening point, medium viscosity, good tack, and very long open timeApplications: Component of hot mel.. |