Polymer Property : Viscosity = 70000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ AO420 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive , high toughness.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1020 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA1023 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, all purpose.Information provided by Illinois Tool Works.
Viscosity	50000 - 70000 cP	50000 - 70000 cP	B
ITW Plexus Plexusâ„¢ MA920 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, short open time.Information provided by Illinois Tool Works.
Viscosity	30000 - 70000 cP	30000 - 70000 cP	Part A
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
Viscosity	60000 - 70000 cP @Temperature 23.0 °C	60000 - 70000 cP @Temperature 73.4 °F
Master Bond EP51HT Fast Curing High Temperature Resistant Epoxy Adhesive Master Bond Polymer Adhesive EP51HT represents a significant advance in epoxy adhesive technology featuring an excellent balance of performance properties, including convenient curing at ambient tem..
Viscosity	60000 - 70000 cP @Temperature 23.0 °C	60000 - 70000 cP @Temperature 73.4 °F
Master Bond EP65HT-1 Fast Curing High Glass Transition Temperature Epoxy System Master Bond Polymer System EP65HT-1 features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition tempera..
Viscosity	40000 - 70000 cP	40000 - 70000 cP	Part A
Master Bond EP21FRNS-2 Two Component, Flame Resistant Epoxy System Master Bond Polymer System EP21FRNS-2 is a two component, room temperature curing, flame retardant compound for potting, encapsulating and casting. Particularly noteworthy are its low smoke generati..
Viscosity	40000 - 70000 cP	40000 - 70000 cP	Part A
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
Viscosity	40000 - 70000 cP	40000 - 70000 cP	Part A
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Viscosity	50000 - 70000 cP	50000 - 70000 cP	uncured coating
Master Bond UV15DC80 One Component, UV and Heat Curable Epoxy System Master Bond UV15DC80 is a special dual cure epoxy based system which offers a primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curin..
Viscosity	40000 - 70000 cP @Temperature 23.0 °C	40000 - 70000 cP @Temperature 73.4 °F	5 rpm
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Viscosity	45000 - 70000 cP @Temperature 23.0 °C	45000 - 70000 cP @Temperature 73.4 °F	50 rpm
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Viscosity	40000 - 70000 cP @Temperature 23.0 °C	40000 - 70000 cP @Temperature 73.4 °F	5 rpm
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de..
Viscosity	40000 - 70000 cP	40000 - 70000 cP
Aremco Ceramabond™ 516 High Temperature Ceramic Adhesive/Paste, Zirconia Filled Aremco's ceramic adhesives are easy to use, one- and two-component systems which air dry in 1-2 hrs and are ready for use following a 200 to 700 °F cure. These materials are mostly water-based and..
Viscosity	30000 - 70000 cP	30000 - 70000 cP	Base
3M Scotch-Weld™ DP110 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are two-part epoxy adhesive which combine a fast cure with flexibilityInformation provided by 3M
Viscosity	30000 - 70000 cP	30000 - 70000 cP	Accelerator
3M Scotch-Weld™ DP110 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are two-part epoxy adhesive which combine a fast cure with flexibilityInformation provided by 3M