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Polymer Property : Viscosity = 270000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 270000 cP

@Shear Rate 1000 1/s,
Temperature 400 °C
270000 cP

@Shear Rate 1000 1/s,
Temperature 752 °F
Melt
Solvay Specialty Polymers AvaSpire® AV-742 SL30 Polyaryletherketone (PAEK)  (Unverified Data**)
AV-742 SL30 is a wear resistant grade of AvaSpire polyaryletherketone (PAEK) designed to provide low wear rates in both non-lubricated and lubricated environments. In addition to outstanding wear re..
Viscosity 270000 cP

@Shear Rate 1000 1/s,
Temperature 400 °C
270000 cP

@Shear Rate 1000 1/s,
Temperature 752 °F
Melt; ASTM D3835
Solvay Specialty Polymers KetaSpire® KT-820 SL30 Polyetheretherketone (PEEK)  (Unverified Data**)
Ketaspire KT-820 SL30 is a polyetheretherketone (PEEK) compound designed to provide a balance of excellent mechanical properties, wear resistance and low coefficient of friction in both dry and exte..
Viscosity 270000 cP

@Shear Rate 1000 1/s,
Temperature 400 °C
270000 cP

@Shear Rate 1000 1/s,
Temperature 752 °F
Melt Viscosity; ASTM D3835
Solvay Specialty Polymers AvaSpire® AV-742 SL30 Polyaryletherketone (PAEK)
AV-742 SL30 is a wear resistant grade of AvaSpire® polyaryletherketone (PAEK) designed to provide low wear rates in both non-lubricated and lubricated environments. In addition to outstanding wea..
Viscosity 270000 cP

@Shear Rate 1000 1/s,
Temperature 400 °C
270000 cP

@Shear Rate 1000 1/s,
Temperature 752 °F
Melt Viscosity; ASTM D3835
Solvay Specialty Polymers KetaSpire® KT-820 SL30 Polyetheretherketone (PEEK)
KetaSpire® KT-820 SL30 is a polyetheretherketone (PEEK) compound designed to provide a balance of excellent mechanical properties, wear resistance and low coefficient of friction in both dry and ..
Viscosity 270000 cP

@Temperature 25.0 °C
270000 cP

@Temperature 77.0 °F
After mixing
Tra-Con Tra-Bond 968-5 High Dielectric Constant Epoxy Adhesive
TRA-BOND 968-5 is a high dielectric constant epoxy adhesive. This one component, electrically insulating epoxy adhesive is designed for chip bonding.Information provided by Tra-Con Inc.
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