Polymer Property : Viscosity = 2200 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	2200 cP	2200 cP	Mixed; TM R050-12
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Viscosity	2200 cP @Shear Rate 11200 1/s, Temperature 200 °C	2200 cP @Shear Rate 11200 1/s, Temperature 392 °F	ASTM D3835
PolyOne Versaflex™ CL2000X Thermoplastic Elastomer (TPE) Versaflex™ CL2000X is an ultra-soft TPE designed for use in injection molding applications where exceptional clarity and an extremely soft feel are desired. - Tactile Feel - Ultra-Soft - Water Clar..
Viscosity	2200 - 4300 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	2200 - 4300 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2030408P3 Carbon Graphite Ink This product is designed to be used for screen printing working electrodes. This is a carbon/graphite ink which has been optimized to give superior electrochemical performance and contains Cobalt Ph..
Viscosity	2200 cP @Shear Rate 50.0 1/s, Temperature 240 Â°C	2200 cP @Shear Rate 50.0 1/s, Temperature 464 Â°F	Melt; ASTM D3835
Kureha KF Polymer 1000 PVDF Homopolymer KF Polymer is a fire-resistant engineering plastic which maintains the excellent performance of a fluoropolymer. It shows well-balanced molding processability similar to general-purpose resins. KF p..
Viscosity	2200 - 2400 cP @Temperature 23.0 °C	2200 - 2400 cP @Temperature 73.4 °F
Master Bond MB297 Cyanoacrylate Adhesive System General purpose, fills gap to 0.008Information provided by Master Bond Inc.
Viscosity	2200 cP	2200 cP	Mixed (cp #40, 2.5 rpm)
Tra-Con Tra-Bond 516E01 Information provided by Tra-Con Inc.
Viscosity	2200 cP @Temperature 25.0 °C	2200 cP @Temperature 77.0 °F	Mixed (rv #4, 20 rpm)
Tra-Con Tra-Bond F113SC BLK High Tg Fiber Optic Epoxy Adhesive TRA-BOND F113SC BLK is a fiber optic adhesive used for terminating ALL types of fiber optic connectors as well as LED displays, lenses and other optical components. It produces a typical Tg of 95°C..
Viscosity	2200 cP @Temperature 25.0 °C	2200 cP @Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Stycast® 2651-40/23LV Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as ..
Viscosity	2200 cP @Temperature 25.0 °C	2200 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond 2202 Low Viscosity/High Temperature Epoxy Adhesive TRA-BOND 2202 is a low viscosity, high temperature cure epoxy resin system developed for rigid laminating, filament winding, potting and bonding applications where a clear, almost transparent adhesi..
Viscosity	2200 cP @Temperature 25.0 °C	2200 cP @Temperature 77.0 °F
Cytec EN-2534 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Viscosity	2200 - 3200 cP @Temperature 23.0 °C	2200 - 3200 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Viscosity	2200 - 3200 cP @Temperature 23.0 °C	2200 - 3200 cP @Temperature 73.4 °F	100 rpm
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte..
Viscosity	2200 cP	2200 cP	dynamic
Dow Corning EG-3000 THIXOTROPIC GEL PARTS A&B Two-part, heat cure, thixotropic gel.Information provided by Dow Corning
Viscosity	2200 cP @Temperature 180 °C	2200 cP @Temperature 356 °F	Modified Bitumen Property in waterproof membranes (150/200 bitumen + 12% polymer)
Dynasol Solprene® 411 Thermoplastic Rubber SBS Dry Solprene 411 is a 70/30 butadiene/styrene thermoplastic copolymer, polymerized in solution and has a radial structure.This product is available in:S 411 porous crumbS 411M powder form dusted with am..
Viscosity	2200 cP	2200 cP	Mixed
Armstrong C-1/A Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Viscosity	2200 cP	2200 cP	Mixed
Armstrong C-1/H20 Epoxy Adhesive A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compoundsInfor..
Viscosity	2200 cP	2200 cP
ACC EP MAP-7.5 EPI Engineered Polymers Aliphatic Polymer EP MAP, “Powered by Reactamine® Technology”, are modified aliphatic prepolymers with monomer-extracted levels of a maximum of 0.2%. The polymers are made from HDI. EP MAP-7.5 contains 7.5% NCO. ..
Viscosity	2200 cP @Temperature 180 °C	2200 cP @Temperature 356 °F	Modified Bitumen Property in waterproof membranes (150/200 bitumen + 12% polymer)
Dynasol Calprene® 411 Thermoplastic Rubber SBS Dry Calprene 411 is a 70/30 Butadiene/Styrene thermoplastic copolymer, polymerized in solution and has a radial structure.This product is available in:C 411 porous crumbC 411C porous pelletC 411M powder..
Viscosity	2200 cP	2200 cP	Mixed; TM R050-12
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..