Physical Properties | Metric | English | Comments |
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Viscosity | 90000 - 120000 cP | 90000 - 120000 cP | A |
ITW Plexus Plexusâ„¢ MA820 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Excellent for structural bonding of surface metals with no surface preparation.Information provide.. |
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Viscosity | 90000 - 120000 cP | 90000 - 120000 cP | A |
ITW Plexus Plexusâ„¢ MA821 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Designed for structural bonding of metals without primers.Information provided by Illinois Tool Wo.. |
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Viscosity | 50000 - 120000 cP | 50000 - 120000 cP | Part A |
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu.. |
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Viscosity | 80000 - 120000 cP @Temperature 23.0 °C |
80000 - 120000 cP @Temperature 73.4 °F |
2.5 rpm |
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and .. |
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Viscosity | 80000 - 120000 cP @Temperature 23.0 °C |
80000 - 120000 cP @Temperature 73.4 °F |
2.5 rpm |
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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Viscosity | 100000 - 120000 cP @Temperature 23.0 °C |
100000 - 120000 cP @Temperature 73.4 °F |
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Master Bond Supreme 45HTQ Quartz Filled, Heat Resistant Epoxy Compound Master Bond Polymer Adhesive Supreme 45HTQ is a two component, toughened, quartz filled epoxy compound for high performance structural bonding and casting. It is suitable for applications where long.. |