Physical Properties | Metric | English | Comments |
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Viscosity | 12000 - 175000 cP | 12000 - 175000 cP | |
ND Industries 907 Anti-seize Nickel-Graphite Nickel anti-seize for high temperatures and severe service |
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Viscosity | 12000 cP | 12000 cP | Mixed; TM R050-12 |
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
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Viscosity | 12000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
12000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake Viscosity |
Gwent Electronic Materials C2030325D14 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and .. |
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Viscosity | 12000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
12000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2041206P2 Gold Polymer Electrode Paste Gold paste is a screen printable gold polymer paste designed as a working electrode in electrochemical biosensors. This is used as a working electrode in medical diagnostics, environmental sensor a.. |
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Viscosity | 12000 - 15000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
12000 - 15000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2050830D8 80:20 Silver Palladium Ink C2050830D8 is an ink based on a 80:20 ratio of Silver:Palladium. It is designed for use in Single Layer PZT applications. This ink can be used in both dip and hand soldering. This Ink is in a ready .. |
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Viscosity | 12000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
12000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarCLEAR CLR-1050 TPE Product Description: StarCLEAR CLR-1050 is an easy processing TPE designed for injection molding. Soft and ultra clear TPEs specifically targeted to medical, consumer and sporting goods market. Feat.. |
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Viscosity | 12000 - 15000 cP | 12000 - 15000 cP | |
Master Bond Mastersil 150 Two Part, Condensation Cured, Flexible Silicone Master Sil 150 is a 2 part condensation cured liquid silicone which, after the addition of curing agent 150, cures at room temperature to a tough, resilient silicone rubber potting and encapsulation.. |
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Viscosity | 12000 cP @Temperature 25.0 °C |
12000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® E-1030 One-Component Epoxy Low Stress Encapsulant Emerson & Cuming E-1030 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te.. |
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Viscosity | 12000 cP @Temperature 25.0 °C |
12000 cP @Temperature 77.0 °F |
Mixed (sp #7, 10 rpm) |
Tra-Con Tra-Bond 216H02 Opaque Black Epoxy Casting Compound TRA-CAST 216H02 is a medium viscosity two-part formulation recommended for general purpose electrical potting and encapsulation applications where the combination of good mechanical thermal and elec.. |
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Viscosity | 12000 cP | 12000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® 38 PVC PVC Homopolymer Dispersion Resin F-38 is a high molecular weight PVC homopolymer dispersion resin which exhibits low paste viscosities, exceptional air release as well as a balance of other properti.. |
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Viscosity | 12000 - 15000 cP | 12000 - 15000 cP | Dynamic |
Dow Corning XIAMETER® PMCPOHX-4040 Polymer 14000CS Is chemically equivalent to DOW CORNING® 3-0084 POLYMER. Polydimethylsiloxane polymer with terminated, curable silanol functionality.Information provided by Dow Corning |
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Viscosity | 12000 - 20000 cP @Temperature 23.0 °C |
12000 - 20000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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Viscosity | 12000 - 16000 cP @Temperature 23.0 °C |
12000 - 16000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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Viscosity | 12000 cP @Temperature -40.0 °C |
12000 cP @Temperature -40.0 °F |
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ExxonMobil Mobil Multi-Vehicle ATF Mobil Multi-Vehicle ATF is a premium synthetic blend lubricant formulated to provide excellent service in a wide variety of automotive automatic transmission applications. It is approved for use i.. |
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Viscosity | 12000 cP | 12000 cP | |
Dymax 914-A Strain Relief, Wire and Parts Tacking Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 914-A Strain Relief, Wire and Parts Tacking AdhesiveFaster curing, good insulation qualities, shock absorbing, deep .. |
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Viscosity | 12000 cP @Temperature -40.0 °C |
12000 cP @Temperature -40.0 °F |
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ConocoPhillips Hydroclear® V Automatic Transmission Fluid Description: Conoco Hydroclear MERCON V Automatic Transmission Fluid is a premium multifunctional product that has been approved for use in all General Motors and Ford transmissions. It carries both.. |
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Viscosity | 12000 cP | 12000 cP | |
ACC MM50T Low Tear Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: low viscosity, good resistance to styrene attack, easy degassing, low shrinkage, range of catalysts. Applications: sh.. |
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Viscosity | 12000 cP | 12000 cP | |
ACC QSil 940 QSI Quantum Silicones 40 Durometer Condensation Cure for Potting QSil 940 is a special purpose, two-component condensation cure siloxane elastomer that exhibits excellent release properties unless a primer is used which results in excellent adhesion. The material.. |
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Viscosity | 12000 cP | 12000 cP | Mixed Viscosity |
Aremco Aremco-Bond™ 820 High Performance Epoxide Clear, 1:1, 45-Minute Cure System with Good Flexibility |
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Viscosity | 12000 cP | 12000 cP | mixed |
Aremco Ceramacast™ 510 High Temperature Potting & Casting Material Alumina Coarse grain castable for producing large hi-temp tooling. |
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Viscosity | 12000 cP | 12000 cP | mix |
Aremco Ceramacast™ 673-N High Temperature Potting & Casting Material Silicon Carbide Single-part castable ceramic exhibiting high strength and thermal conductivity. |
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Viscosity | 12000 - 16000 cP | 12000 - 16000 cP | uncured |
Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei.. |
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Viscosity | 12000 cP @Temperature 177 °C |
12000 cP @Temperature 350 °F |
Typical |
Bostik 6370 Very Flexible EVA Glue Stick Bostik 6370 Very Flexible EVA Glue StickVery flexible. Bonds wide range of floral, craft and upholstery materials. |
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Viscosity | 12000 cP @Temperature 25.0 °C |
12000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond 2130 Medium Viscosity Epoxy Adhesive TRA-BOND 2130 is a clear, near transparent, medium viscosity epoxy adhesive formulation developed for rigid laminating, sealing and bonding applications where the combination of good wetting plus im.. |
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Viscosity | 12000 cP | 12000 cP | catalyzed with QM CAT RED 3 |
ACC QM 113 QSI Quantum Silicones 13 Durometer Condensation Cured Moldmaking Material QM 113 is a two component, room temperature condensation cure silicone material. The cured rubber is very soft, has excellent mechanical properties and good shelf-life stability. This material is an.. |
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Viscosity | 12000 cP | 12000 cP | Mixed; TM R050-12 |
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an.. |