Physical Properties | Metric | English | Comments |
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Viscosity | 5000 - 35000 cP @Temperature 60.0 °C |
5000 - 35000 cP @Temperature 140 °F |
Measured with parallel plate in dynamic mode ar 10 rad/s and a strain of 1%. |
Nanocyl EPOCYL™ NC R1MY-02 Master Batch Liquid tetrafunctional epoxy Resin for Hot-Melt Formulation Purposes: Dilution Factor 6 EPOCYL™ NC R1MY-02 is a Master Batch based on liquid tetrafunctional epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl, with a suggested dilution factor of 6. .. |
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Viscosity | 5000 - 20000 cP @Temperature 25.0 °C |
5000 - 20000 cP @Temperature 77.0 °F |
TA4592B, at 20 rpm vibration |
Permabond TA4592 Toughened Acrylic Adhesive PERMABOND® TA4592 is a two component structural acrylic adhesive ideal for bonding magnets and ferrites for electric motors on fast-moving production lines. Permabond® TA4592 provides high strengt.. |
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Viscosity | 5000 - 35000 cP @Temperature 60.0 °C |
5000 - 35000 cP @Temperature 140 °F |
Measured with parallel plate in dynamic mode ar 10 rad/s and a strain of 1%. |
Nanocyl EPOCYL™ NC E1MY-02 Master Batch Liquid tetrafunctional epoxy Resin for non-Solvent Formulation Purposes EPOCYL™ NC E1MY-02 is a Mater Batch based on liquid tetrafunctional epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl. It is specifically developed to enhance.. |
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Viscosity | 5000 cP @Temperature 25.0 °C |
5000 cP @Temperature 77.0 °F |
Standard, uncured |
Resin Technology Group MX-2212 High Impact, Multi-Functional, UV Curing Adhesive This multi-functional product is a rapid setting structural adhesive. UV-MX 2212 provides high impact, resilient bonds to many similar and dissimilar substrates. Multi-functional cure bonds are form.. |
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Viscosity | 5000 - 14000 cP @Temperature 25.0 °C |
5000 - 14000 cP @Temperature 77.0 °F |
D Curative |
Lord Adhesives 7542 Urethane Adhesive LORD® 7542 adhesive is an equal-mix, two-component urethane adhesive system used to bond FRP, SMC and other plastics with little surface preparation. This adhesive will also bond primed metals. L.. |
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Viscosity | 5000 - 18000 cP @Temperature 25.0 °C |
5000 - 18000 cP @Temperature 77.0 °F |
E Curative |
Lord Adhesives 7542 Urethane Adhesive LORD® 7542 adhesive is an equal-mix, two-component urethane adhesive system used to bond FRP, SMC and other plastics with little surface preparation. This adhesive will also bond primed metals. L.. |
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Viscosity | 5000 - 8000 cP @Shear Rate 250 1/s, Temperature 25.0 °C |
5000 - 8000 cP @Shear Rate 250 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2110309D5 Carbon Graphite Ink This is designed for screen-printing of working electrodes for electrochemical sensors. The paste is formulated to give superior printing properties with good definition for fine line printing.Produ.. |
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Viscosity | 5000 cP @Shear Rate 10.0 1/s, Temperature 230 °C |
5000 cP @Shear Rate 10.0 1/s, Temperature 446 °F |
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Solvay TECHNYL® eXten D 437P PA6.10 Description: TECHNYL® eXten D 437P is a high viscosity, unfilled, plasticized, UV and heat stabilized PA6.10 for extrusion applications. Technyl® eXten D 437P is a partially biosourced materia.. |
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Viscosity | 5000 - 15000 cP @Temperature 40.0 °C |
5000 - 15000 cP @Temperature 104 °F |
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Master Bond UV24TKLO One Component, UV-Curable, Low Outgassing Adhesive System Master Bond Polymer System UV24TKLO is a one part UV curable epoxy modified formulation for bonding, sealing and encapsulation. It passes the rigorous requirements for low outgassing as per ASTM E-5.. |
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Viscosity | 5000 cP @Temperature 200 °C |
5000 cP @Temperature 392 °F |
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3M Scotch-Weld™ 3748 VO Hot Melt Adhesive Self-extinguishing version of 3748 and Meets UL 1410 requirementsInformation provided by 3M |
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Viscosity | 5000 cP @Temperature 40.0 °C |
5000 cP @Temperature 104 °F |
35% solution in DMAc (measured at 25% solids); Internal Method |
Solvay Specialty Polymers Veradel® 3000RP Polyethersulfone (PESU)
(Unverified Data**) Veradel® 3000RP hydroxyl-functionalized polyethersulfones (r-PESU) is an amorphous, high-temperature sulfone polymer featuring reactive end groups to enhance solubility for dissolving or dispersing.. |