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Polymer Property : Spiral Flow = 62.0 cm Product List

Physical Properties

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Physical Properties Metric English Comments
Spiral Flow 43.0 - 62.0 cm

@Temperature 220 - 220 °C
16.9 - 24.4 in

@Temperature 428 - 428 °F
Average value: 51.9 cm Grade Count:7
Overview of materials for Polystyrene, Heat Resistant Grade
This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Heat Resistant Grade". Each property range of values reported is minimum and maximum values..
Spiral Flow 48.0 - 62.0 cm
18.9 - 24.4 in
177°C/1000 psi
Cookson Group Plaskon® 3400F Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
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