Physical Properties | Metric | English | Comments |
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Spiral Flow | 48.0 - 62.0 cm | 18.9 - 24.4 in | 177°C/1000 psi |
Cookson Group Plaskon® 3400F Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs .. |
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Spiral Flow | 48.0 - 610 cm | 18.9 - 240 in | Average value: 163 cm Grade Count:10 |
Overview of materials for Nylon 6, 40% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, 40% Glass Fiber Filled". Specific grades with glass content between 35% and 44% are included. E.. |
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Spiral Flow | 48.0 - 180 cm | 18.9 - 70.9 in | Average value: 107 cm Grade Count:52 |
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr.. |