Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 74.0 cm | 29.1 in | 175°C/1000 psi |
Cookson Group Plaskon® 150.401 Encapsulation Resin
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade .. |