- HOME
- POLYMER SEARCH
- Polymer Property : Particle Size = 52 µm
Polymer Property : Particle Size = 52 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | 52 µm | 52 µm | Average Diameter |
| Potters Industries Conduct-O-Fil® SC325P17 Silver-coated Copper Particles Applications EMI shielding, conductive adhesives, conductive paints and coatings. Advantages: Most conductive combination of metals; Dendrites give excellent compression set in FIP gaskets; Flakes .. |
|||
| Particle Size | <= 52 µm | <= 52 µm | 95%; Geon® DFT 1466; Internal Method |
| PolyOne Geon™ FIT E 50 Polyvinyl Chloride Homopolymer (PVC Homopolymer) Geon® FIT E 50 is a low molecular weight homopolymer resin intended for use as a Formulation Improvement Tool (FIT) in plastisol formulations which enhance the plastisol usage (pot life) and reduce.. |
|||
| Particle Size | <= 52 µm | <= 52 µm | 95%; Geon® DFT 1466; Internal Method |
| PolyOne Geon™ FIT E 51 Polyvinyl Chloride Homopolymer (PVC Homopolymer) Geon® FIT E 51 is a medium molecular weight homopolymer resin intended for use as a Formulation Improvement Tool (FIT) in plastisol formulations which enhance the plastisol usage (pot life) and red.. |
|||
| Particle Size | <= 52 µm | <= 52 µm | 95%; Geon® DFT 1466; Internal Method |
| PolyOne Geon™ FIT E 52 Polyvinyl Chloride Homopolymer (PVC Homopolymer) Geon® FIT E 52 is a high molecular weight homopolymer resin intended for use as a Formulation Improvement Tool (FIT) in plastisol formulations which enhance the plastisol usage (pot life) and reduc.. |
|||
| Particle Size | <= 52 µm | <= 52 µm | 98%; Geon® DFT 1466; Internal Method |
| PolyOne Geon™ 210 Series 215 Blending Resin Polyvinyl Chloride Homopolymer (PVC Homopolymer) Geon® 215 is a low molecular weight particle size homopolymer blending resin intended for use in plastisol formulations. It improves air release performance resulting in reduced scrap rates. It dec.. |
|||
| Particle Size | <= 52 µm | <= 52 µm | 94.2%; Geon® DFT 1466; Internal Method |
| PolyOne Geon™ 210 Series 217 Blending Resin Polyvinyl Chloride Homopolymer (PVC Homopolymer) Geon® 217 is a low to medium molecular weight homopolymer blending resin intended for use as a formulation tool in plastisol formulations.It improves air release performance resulting in reduced sc.. |
|||
| Particle Size | 52 - 60 µm | 52 - 60 µm | 90% |
| H.C. Starck Amperit® 586.1 Chromium Carbide-Nickel Chromium 80-20 (Cr3C2-NiCr) |
|||
| Particle Size | 52 - 62 µm | 52 - 62 µm | 90% |
| H.C. Starck Amperit® 552.074 Tungsten Carbide - Chromium Carbide-Nickel 73-20-7 (WC-CrC-Ni) |
|||
| Particle Size | 52 µm | 52 µm | TEC QSD |
| Trelleborg AEM Eccospheres® SI-250 Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
|||
| Particle Size | 52 µm | 52 µm | TEC QSD |
| Trelleborg AEM Eccospheres® SID-230Z Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
|||
| Particle Size | 52 µm | 52 µm | Laser diffraction; d<sub>50</sub>; ISO 13320 |
| CRP Technology Windform® PS Polystyrene for Selective Laser Sintering Windform® PS is a polystyrene based material, developed specifically to produce complex investment casting patterns. The sintered patterns are ideal for conventional wax infiltration, and become ea.. |
|||
Copyright © lookpolymers.com All Rights Reserved