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Polymer Property : Density = 3.00 g/cc Product List

Physical Properties

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Physical Properties Metric English Comments
Density 3.00 g/cc
0.108 lb/in³
Nabaltec APYRAL® AOH 30 AlO(OH) Boehmite
Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch..
Density 3.00 g/cc
0.108 lb/in³
Nabaltec APYRAL® AOH 60 AlO(OH) Boehmite
Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch..
Density 3.00 g/cc
0.108 lb/in³
Rogers Corporation RO3210 Woven-Glass Reinforced PTFE Laminate
Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel..
Density 3.00 g/cc
0.108 lb/in³
Nabaltec APYRAL® AOH 20 AlO(OH) Boehmite
Mineral flame retardant for wire and cable industry, electronic industry and public transport.Properties:High temperature applicationsLow sedimentation at good viscosity performance in resinsGood ch..
Density 3.00 g/cc
0.108 lb/in³
after firing to 110°C
Pyrotek Pyrocast 92AC Tabular Alumina Based Low Cement Castable
Pyrocast 92AC is a tabular alumina based low cement castable, enhanced with non-wetting matrix. The silica-free matrix eliminates the potential for aluminum attack on silica with in the bonding mat..
Density 3.00 g/cc
0.108 lb/in³
Apparent
Gouda Vuurvast AK 85 K Dense Refractory Brick
Description: Corundum based bricks with a mullite bond. Application: rotating incinerator furnacesRemarks: This data represents average values, obtained from samples that were cut from standard bric..
Density 3.00 g/cc
0.108 lb/in³
LATI Laticonther 83 CP/85 PA12, Impact Modified
High thermal conductivity product based on Polyamide 12 (PA12), impact modified. Special filler.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation prov..
Density 3.00 g/cc
0.108 lb/in³
Schott 8235 Dental Glass
Remarks: Ba-containing, without FApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provided by SCHOTT North ..
Density 3.00 g/cc
0.108 lb/in³
Schott G018-186 Dental Glass
Remarks: Ba- and F-containing, high refractive glassApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provid..
Density 3.00 g/cc
0.108 lb/in³
Schott G018-310 Dental Glass
Remarks: Zr-containing, high refractive indexApplication: CompositeAdvantagesGreater variety of composition and refractive indiciesOutstanding transparencyBest radiopacitiesInformation Provided by S..
Density 3.00 g/cc
0.108 lb/in³
ASTM D792
Techmer ES HiFill® ABS HI 0300 High Impact
Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: High Density and High Impact ResistanceProcessing Method: Injection MoldingInformation provided by ..
Density 3.00 g/cc
0.108 lb/in³
Specialty Materials SCS-6 Silicon Carbide Monofilament
High strength at high temperature. These fibers are used in metal, ceramic and polymer matrix composites and are extremely effective for high-temperature applications. Silicon carbide reinforced tit..
Density 3.00 g/cc
0.108 lb/in³
Schott N-KZFS4 Glass
Information Provided by SCHOTT North America, Inc.
Density 3.00 g/cc
0.108 lb/in³
ASTM C135
M Cubed Technologies SSC-702 Reaction-Bonded Silicon Carbide
Medium-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info..
Density 3.00 g/cc
0.108 lb/in³
ASTM C135
M Cubed Technologies SSC-802 Reaction-Bonded Silicon Carbide
Medium-grained reaction-bonded SiC for high wear applications. Bullnoses, fan liners, hydrocyclone liners, etc. Can be cast into very large shapes (greater than 4 ft. square, 5-6 inches thick)Info..
Density 3.00 g/cc
0.108 lb/in³
ASTM C135
M Cubed Technologies SSC-FG Reaction-Bonded Silicon Carbide, Fine-Grained
Fine-grained reaction-bonded SiC. Used for mechanical seals and other SiC applications that require a high surface finish/tight tolerances. Si content can be tailored for the application.Informati..
Density 3.00 g/cc
0.108 lb/in³
ISO 1183
Polyram Metal Cap PL380Z81 Heavy Density Polyethylene, 81% Mineral Filled
81% Mineral filled, heavy density polyethylene for injection molding metalized part and galvanized covers.Information provided by Polyram.
Density 3.00 g/cc
0.108 lb/in³
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G..
Density 3.00 g/cc
0.108 lb/in³
Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive
EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and..
Density 3.00 g/cc
0.108 lb/in³
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive
EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
Density 3.00 g/cc
0.108 lb/in³
Epoxyset Epoxiohm EO-23M Electrically Conductive Epoxy Adhesive
EO-23M is an electrically conductive, low viscosity silver-filled epoxy adhesive. Used for hybrid / micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.I..
Density 3.00 g/cc
0.108 lb/in³
ASTM D1475
Aptek 2313-PMF Hybrid Epoxy Adhesive
Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s..
Density 3.00 g/cc
0.108 lb/in³
ASTM D1475
Aptek 6512-PMF Electronic grade, conductive epoxy adhesive
APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APT..
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